SBAS803A November   2016  – November 2017 MUX506 , MUX507

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: Dual Supply
    6. 6.6 Electrical Characteristics: Single Supply
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1  Truth Tables
    2. 7.2  On-Resistance
    3. 7.3  Off Leakage
    4. 7.4  On-Leakage Current
    5. 7.5  Transition Time
    6. 7.6  Break-Before-Make Delay
    7. 7.7  Turn-On and Turn-Off Time
    8. 7.8  Charge Injection
    9. 7.9  Off Isolation
    10. 7.10 Channel-to-Channel Crosstalk
    11. 7.11 Bandwidth
    12. 7.12 THD + Noise
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Ultralow Leakage Current
      2. 8.3.2 Ultralow Charge Injection
      3. 8.3.3 Bidirectional Operation
      4. 8.3.4 Rail-to-Rail Operation
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from * Revision (November 2016) to A Revision

  • Changed Transition Time From: 85 ns To: 97ns (Typ) in the Features listGo
  • Added SOIC packages to Feature and Device Information Go
  • Added the DW (SOIC) package to the Pin Configuration and Functions sectionGo
  • Added SOIC package to the Thermal Information tableGo
  • Changed Transition time Typ value From 85: ns To: 97ns for ±15 V supplies in the Electrical Characteristics: Dual Supply tableGo
  • Added additional specifications for the SOIC packages (QJ, Off-isolation, and channel-to-channel crosstalk) for ±15 V supplies in Electrical Characteristics: Dual SupplyGo
  • Changed Transition time Typ value From: 91 To: 102 ns for 12 V supply in the Electrical Characteristics: Single Supply tableGo
  • Added additional specifications for the SOIC packages (QJ, Off-isolation, and channel-to-channel crosstalk) for 12 V supply in Electrical Characteristics: Single SupplyGo
  • Added NOTE to the Application and Implementation sectionGo