OMAP3503 high-performance, applications processor is based on the enhanced OMAP 3 architecture.
The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:
The device supports high-level operating systems (OSs), such as:
This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.
The following subsystems are part of the device:
The device also offers:
OMAP3503 is available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package.
Table 1-1 lists the differences between the CBB, CBC, and CUS packages.
This OMAP3503 Applications Processor data manual presents the electrical and mechanical specifications for the OMAP3503 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the OMAP3503 Applications Processor unless otherwise indicated. It consists of the following sections:
(1) HiRel currently offers only CBC package. For CBB and CUS packages please contact TI sales.
OMAP is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
|Part number||Order||Arm MHz (Max.)||DRAM||Approx. price (US$)||Arm CPU||USB||SPI||I2C||Display||Operating temperature range (C)||Serial I/O|
||720||LPDDR||47.60 | 100u||1 Arm Cortex-A8||2||4||3||DSS||0 to 90||