SBOS727B November 2015  – May 2016 OPA1622


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1Absolute Maximum Ratings
    2. 6.2ESD Ratings
    3. 6.3Recommended Operating Conditions
    4. 6.4Thermal Information
    5. 6.5 Electrical Characteristics:
    6. 6.6Typical Characteristics
  7. Detailed Description
    1. 7.1Overview
    2. 7.2Functional Block Diagram
    3. 7.3Feature Description
      1. 7.3.1Power Dissipation
      2. 7.3.2Thermal Shutdown
      3. 7.3.3Enable Pin
      4. 7.3.4Ground Pin
      5. 7.3.5Electrical Overstress
      6. 7.3.6Input Protection
    4. 7.4Device Functional Modes
      1. 7.4.1Shutdown Mode
      2. 7.4.2Output Transients During Power Up and Power Down
  8. Application and Implementation
    1. 8.1Application Information
      1. 8.1.1Noise Performance
        1. Calculations
        2. Curve
        3. Noise Calculations
      2. 8.1.2Total Harmonic Distortion Measurements
    2. 8.2Typical Application
      1. 8.2.1Design Requirements
      2. 8.2.2Detailed Design Procedure
      3. 8.2.3Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1Layout Guidelines
    2. 10.2Layout Example
  11. 11Device and Documentation Support
    1. 11.1Device Support
      1. 11.1.1Development Support
        1. (Free Software Download)
        2. Precision Designs
    2. 11.2Documentation Support
      1. 11.2.1Related Documentation
    3. 11.3Community Resources
    4. 11.4Trademarks
    5. 11.5Electrostatic Discharge Caution
    6. 11.6Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

For best operational performance of the device, use good printed circuit board (PCB) layout practices, including:

  • Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-supply applications. The bypass capacitors are used to reduce the coupled noise by providing low-impedance power sources local to the analog circuitry, because noise can propagate into analog circuitry through the power pins of the circuit as a whole and the op amp specifically.
  • Connect the IC ground pin to a low-impedance, low-noise, system reference point, such as an analog ground.
  • Place the external components as close to the device as possible. As shown in Figure 60, keep feedback resistors close to the inverting input to minimize parasitic capacitance and the feedback loop area.
  • Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitive part of the circuit.
  • For proper amplifier function, connect the package thermal pad to the most negative supply voltage (VEE).

10.2 Layout Example

OPA1622 d302_pcblayout.gif Figure 60. Operational Amplifier Board Layout for a Difference Amplifier Configuration