SBOS727B November 2015  – May 2016 OPA1622

PRODUCTION DATA. 

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1Absolute Maximum Ratings
    2. 6.2ESD Ratings
    3. 6.3Recommended Operating Conditions
    4. 6.4Thermal Information
    5. 6.5 Electrical Characteristics:
    6. 6.6Typical Characteristics
  7. Detailed Description
    1. 7.1Overview
    2. 7.2Functional Block Diagram
    3. 7.3Feature Description
      1. 7.3.1Power Dissipation
      2. 7.3.2Thermal Shutdown
      3. 7.3.3Enable Pin
      4. 7.3.4Ground Pin
      5. 7.3.5Electrical Overstress
      6. 7.3.6Input Protection
    4. 7.4Device Functional Modes
      1. 7.4.1Shutdown Mode
      2. 7.4.2Output Transients During Power Up and Power Down
  8. Application and Implementation
    1. 8.1Application Information
      1. 8.1.1Noise Performance
        1. 8.1.1.1Noise Calculations
        2. 8.1.1.2Application Curve
        3. 8.1.1.3Basic Noise Calculations
      2. 8.1.2Total Harmonic Distortion Measurements
    2. 8.2Typical Application
      1. 8.2.1Design Requirements
      2. 8.2.2Detailed Design Procedure
      3. 8.2.3Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1Layout Guidelines
    2. 10.2Layout Example
  11. 11Device and Documentation Support
    1. 11.1Device Support
      1. 11.1.1Development Support
        1. 11.1.1.1TINA-TI (Free Software Download)
        2. 11.1.1.2TI Precision Designs
    2. 11.2Documentation Support
      1. 11.2.1Related Documentation
    3. 11.3Community Resources
    4. 11.4Trademarks
    5. 11.5Electrostatic Discharge Caution
    6. 11.6Glossary
  12. 12Mechanical, Packaging, and Orderable Information

5 Pin Configuration and Functions

DRC Package
10-Pin VSON
Top View
OPA1622 po_drc_sbos727.gif

Pin Functions

PINI/ODESCRIPTION
NAMENO.
GND3Connect to ground
EN8IShutdown (logic low), enable (logic high)
+IN A1INoninverting input, channel A
–IN A10IInverting input, channel A
+IN B5INoninverting input, channel B
–IN B6IInverting input, channel B
OUT A9OOutput, channel A
OUT B7OOutput, channel B
V+2Positive (highest) power supply
V–4Negative (lowest) power supply
Thermal padExposed thermal die pad on underside; connect thermal die pad to V–.
Soldering the thermal pad improves heat dissipation and provides specified performance.