SBOS727B November 2015  – May 2016 OPA1622

PRODUCTION DATA. 

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1Absolute Maximum Ratings
    2. 6.2ESD Ratings
    3. 6.3Recommended Operating Conditions
    4. 6.4Thermal Information
    5. 6.5 Electrical Characteristics:
    6. 6.6Typical Characteristics
  7. Detailed Description
    1. 7.1Overview
    2. 7.2Functional Block Diagram
    3. 7.3Feature Description
      1. 7.3.1Power Dissipation
      2. 7.3.2Thermal Shutdown
      3. 7.3.3Enable Pin
      4. 7.3.4Ground Pin
      5. 7.3.5Electrical Overstress
      6. 7.3.6Input Protection
    4. 7.4Device Functional Modes
      1. 7.4.1Shutdown Mode
      2. 7.4.2Output Transients During Power Up and Power Down
  8. Application and Implementation
    1. 8.1Application Information
      1. 8.1.1Noise Performance
        1. 8.1.1.1Noise Calculations
        2. 8.1.1.2Application Curve
        3. 8.1.1.3Basic Noise Calculations
      2. 8.1.2Total Harmonic Distortion Measurements
    2. 8.2Typical Application
      1. 8.2.1Design Requirements
      2. 8.2.2Detailed Design Procedure
      3. 8.2.3Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1Layout Guidelines
    2. 10.2Layout Example
  11. 11Device and Documentation Support
    1. 11.1Device Support
      1. 11.1.1Development Support
        1. 11.1.1.1TINA-TI (Free Software Download)
        2. 11.1.1.2TI Precision Designs
    2. 11.2Documentation Support
      1. 11.2.1Related Documentation
    3. 11.3Community Resources
    4. 11.4Trademarks
    5. 11.5Electrostatic Discharge Caution
    6. 11.6Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MINMAXUNIT
VoltageSupply voltage, VS = (V+) – (V–)40V
Input voltage (signal inputs, enable, ground)(V–) – 0.5(V+) + 0.5
Input differential voltage±0.5
CurrentInput current (all pins except power-supply pins)±10mA
Output short-circuit(2)Continuous
TemperatureOperating, TA–55125°C
Junction, TJ200
Storage, Tstg–65150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Short-circuit to VS / 2 (ground in symmetrical dual supply setups), one amplifier per package.

6.2 ESD Ratings

VALUEUNIT
V(ESD)Electrostatic dischargeHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)±4000V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MINNOMMAXUNIT
Supply voltage, (V+) – (V–)Single-supply4 36V
Dual-supply±2±18
Specified temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1)OPA1622UNIT
DRC (SON)
10 PINS
RθJAJunction-to-ambient thermal resistance47.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance58.1°C/W
RθJBJunction-to-board thermal resistance22.0°C/W
ψJTJunction-to-top characterization parameter0.9°C/W
ψJBJunction-to-board characterization parameter22.2°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance4.1°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics:

at TA = +25°C, VS = ±2 V to ±18 V, VCM = VOUT = midsupply, and RL = 1 kΩ (unless otherwise noted)
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
AUDIO PERFORMANCE
THD+NTotal harmonic distortion + noiseG = 1, f = 1 kHz, VOUT = 3.5 VRMS, RL = 2 kΩ,
80-kHz measurement bandwidth
0.000024%
–132dB
G = 1, f = 1 kHz, VOUT = 3.5 VRMS, RL = 600 Ω,
80-kHz measurement bandwidth
0.000025%
–132dB
G = 1, f = 1 kHz, POUT = 10 mW, RL = 128 Ω,
80-kHz measurement bandwidth
0.000071%
–123dB
G = 1, f = 1 kHz, POUT = 10 mW, RL = 32 Ω,
80-kHz measurement bandwidth
0.000149%
–116dB
G = 1, f = 1 kHz, POUT = 10 mW, RL = 16 Ω,
80-kHz measurement bandwidth
0.000214%
–113dB
IMDIntermodulation distortionSMPTE/DIN two-tone, 4:1 (60 Hz and 7 kHz),
G = 1, VO = 3 VRMS, RL = 2 kΩ, 90-kHz measurement bandwidth
0.000018%
–135dB
CCIF twin-tone (19 kHz and 20 kHz), G = 1,
VO = 3 VRMS, RL = 2 kΩ, 90-kHz measurement bandwidth
0.00005%
–126dB
FREQUENCY RESPONSE
GBWGain-bandwidth productG = 100032MHz
G = 18
SRSlew rateG = –110V/μs
Full-power bandwidth(1)VO = 1 VP1.6MHz
Overload recovery timeG = –10300ns
Channel separation (dual)f = 1 kHz140dB
NOISE
Input voltage noisef = 20 Hz to 20 kHz2.1μVPP
enInput voltage noise density(2) f = 10 Hz10nV/√Hz
f = 100 Hz4
f = 1 kHz2.8
InInput current noise densityf = 10 Hz2.5pA/√Hz
f = 1 kHz0.8
OFFSET VOLTAGE
VOSInput offset voltage±100±500μV
TA = –40°C to +125°C±600
dVOS/dT Input offset voltage drift(2)TA = –40°C to +125°C0.5 2.5 μV/°C
PSRRPower-supply rejection ratio0.13μV/V
INPUT BIAS CURRENT
IBInput bias current1.22.0μA
TA = –40°C to +125°C(2) 2.2
IOSInput offset current±10±50nA
TA = –40°C to +125°C(2)±80
INPUT VOLTAGE RANGE
VCMCommon-mode voltage range(V–) + 1.5(V+) – 1V
CMRRCommon-mode rejection ratio(V–) + 1.5 V ≤ VCM ≤ (V+) – 1 V, TA = –40°C to +125°C110127dB
INPUT IMPEDANCE
Differential60k || 0.8Ω || pF
Common-mode500M || 0.9Ω || pF
OPEN-LOOP GAIN
AOLOpen-loop voltage gain(V–) + 2 V ≤ VO ≤ (V+) – 2 V, RL = 32 Ω, VS = ± 5 V114120dB
(V–) + 1.5 V ≤ VO ≤ (V+) – 1.5 V, RL = 600 Ω, VS = ± 18 V120136
OUTPUT
VOVoltage output swing from railPositive railNo load800mV
RL = 600 Ω900
Negative railNo load800
RL = 600 Ω900
IOUTOutput currentSee Figure 38 and Figure 39mA
ZOOpen-loop output impedanceSee Figure 40Ω
ISCShort-circuit currentVS = ±18 V+145 / –130mA
CLOADCapacitive load driveSee Figure 24pF
ENABLE PIN
VIHLogic high threshold0.82V
TA = –40°C to +125°C0.95
VILLogic low threshold0.78V
TA = –40°C to +125°C0.65
IIHInput currentVEN = 1.8 V1.5μA
POWER SUPPLY
IQQuiescent current
(per channel)
VEN = 2.0 V, IOUT = 0 A2.63.3mA
TA = –40°C to +125°C(2) 4.2
VEN = 0 V, IOUT = 0 A510μA
(1) Full-power bandwidth = SR / (2π × VP), where SR = slew rate.
(2) Specified by design and characterization.

6.6 Typical Characteristics

at TA = 25°C, VS = ±18 V, and RL = 2 kΩ (unless otherwise noted)
OPA1622 C009_SBOS727.png
9250 channels
Figure 1. Input Offset Voltage Histogram
OPA1622 C008_SBOS727.png
4 typical units
Figure 3. Input Offset Voltage vs Temperature
OPA1622 C307_SBOS727.png
Figure 5. Input Voltage Noise Spectral Density vs Frequency
OPA1622 C103_SBOS727.png
Figure 7. 0.1-Hz to 10-Hz Noise
OPA1622 C303_SBOS727.png
Figure 9. Maximum Output Voltage vs Frequency
OPA1622 C001_600_SBOS727.png
600-Ω load
Figure 11. Open-Loop Gain vs Temperature
OPA1622 C106_SBOS727.png
Figure 13. Closed-Loop Gain vs Frequency
OPA1622 C108_SBOS727.png
10 mW, 80-kHz measurement bandwidth
Figure 15. THD+N Ratio vs Frequency
OPA1622 C110_SBOS727.png
1 kHz, 80-kHz measurement bandwidth
Figure 17. THD+N Ratio vs Output Amplitude
OPA1622 C112_SBOS727.png
Figure 19. Channel Separation vs Frequency
OPA1622 C012_SBOS727.png
Figure 21. PSRR vs Temperature
OPA1622 C011_SBOS727.png
Figure 23. CMRR vs Temperature
OPA1622 C117_SBOS727.png
G = 1, 10 mV
Figure 25. Small-Signal Step Response
OPA1622 C120_SBOS727.png
G = –10
Figure 27. Negative Overload Recovery
OPA1622 C119_SBOS727.png
Figure 29. No Phase Reversal
OPA1622 C305_SBOS727.png
Figure 31. IOS vs Temperature
OPA1622 C013_SBOS727_jc.png
VS = ±2 V
Figure 33. IB vs Common-Mode Voltage
OPA1622 C005_SB0S727.png
Figure 35. Quiescent Current vs Supply Voltage
OPA1622 C006_SBOS727.png
Figure 37. Short-Circuit Current vs Temperature
OPA1622 C007B_SB0S727.png
Figure 39. Negative Output Voltage vs Output Current
OPA1622 C010_SBOS727.png
50 channels
Figure 2. Input Offset Voltage Drift Histogram
OPA1622 C013_SBOS727.png
Figure 4. Input Offset Voltage vs Common-Mode Voltage
OPA1622 C306_SBOS727.png
Figure 6. Input Current Noise Spectral Density vs Frequency
OPA1622 C302_SBOS727.png
Figure 8. Voltage Noise vs Source Resistance
OPA1622 C101_SBOS727.png
Figure 10. Open-Loop Gain and Phase vs Frequency
OPA1622 C001_2k_SBOS727.png
2-kΩ load
Figure 12. Open-Loop Gain vs Temperature
OPA1622 C107_SBOS727.png
3.5 VRMS, 80-kHz measurement bandwidth
Figure 14. THD+N Ratio vs Frequency
OPA1622 C109_SBOS727.png
1 kHz, 80-kHz measurement bandwidth
Figure 16. THD+N Ratio vs Output Amplitude
OPA1622 C111_SBOS727.png
90-kHz measurement bandwidth
Figure 18. Intermodulation Distortion vs Output Amplitude
OPA1622 C115_SBOS727.png
Figure 20. PSRR vs Frequency (Referred to Input)
OPA1622 C116_SBOS727.png
Figure 22. CMRR vs Frequency (Referred to Input)
OPA1622 C308_SBOS727.png
Figure 24. Phase Margin vs Capacitive Load
OPA1622 C118_SBOS727.png
G = 1, 10 V
Figure 26. Large-Signal Step Response
OPA1622 C121_SBOS727.png
G = –10
Figure 28. Positive Overload Recovery
OPA1622 C304_SBOS727.png
Figure 30. IB vs Temperature
OPA1622 C014_SBOS727.png
VS = ±18 V
Figure 32. IB vs Common-Mode Voltage
OPA1622 C004_SBOS727.png
Figure 34. Quiescent Current vs Temperature
OPA1622 C309_SBOS727.png
Figure 36. Quiescent Current vs Enable Voltage
OPA1622 C007A_SB0S727.png
Figure 38. Positive Output Voltage vs Output Current
OPA1622 C301_SBOS727.png
Figure 40. Open-Loop Output Impedance vs Frequency