SBOS099D September   2000  – December 2015 OPA2350 , OPA350 , OPA4350

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA350 and OPA2350
    5. 6.5 Thermal Information: OPA4350
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Rail-to-Rail Input
      3. 7.3.3 Rail-to-Rail Output
      4. 7.3.4 Capacitive Load and Stability
      5. 7.3.5 Driving A/D Converters
      6. 7.3.6 Output Impedance
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Second Order Low Pass Filter
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Single-Supply Video Line Driver
      3. 8.2.3 Adding a Feedback Capacitor to Improve Response
      4. 8.2.4 Two Op-Amp Instrumentation Amplifier With Improved High-Frequency Common-Mode Rejection
      5. 8.2.5 10-kHz High-Pass Filter
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI™ (Free Software Download)
        2. 11.1.1.2 TI Precision Designs
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Rail-to-Rail Input
  • Rail-to-Rail Output (Within 10 mV)
  • Wide Bandwidth: 38 MHz
  • High Slew Rate: 22 V/μs
  • Low Noise: 5 nV/√Hz
  • Low THD+Noise: 0.0006%
  • Unity-Gain Stable
  • MicroSize Packages
  • Single, Dual, and Quad

2 Applications

  • Cell Phone PA Control Loops
  • Driving A/D Converters
  • Video Processing
  • Data Acquisition
  • Process Controls
  • Audio Processing
  • Communications
  • Active Filters
  • Test Equipment

OPAx350 Harmonic Distortion

OPA350 OPA2350 OPA4350 sbos099_typchar_6.gif

3 Description

The OPA350 series of rail-to-rail CMOS operational amplifiers are optimized for low voltage, single-supply operation. Rail-to-rail input and output, low noise (5 nV/√Hz), and high speed operation (38 MHz, 22 V/μs) make the amplifiers ideal for driving sampling Analog-to-Digital (A/D) converters. They are also suited for cell phone PA control loops and video processing (75-Ω drive capability), as well as audio and general purpose applications. Single, dual, and quad versions have identical specifications for maximum design flexibility.

The OPA350 series operates on a single supply as low as 2.5 V, with an input common-mode voltage range that extends 300 mV below ground and 300 mV above the positive supply. Output voltage swing is to within 10 mV of the supply rails, with a 10-kΩ load. Dual and quad designs feature completely independent circuitry for lowest crosstalk and freedom from interaction.

The single (OPA350) and dual (OPA2350) come in the miniature MSOP-8 surface mount, SO-8 surface mount, and DIP-8 packages. The quad (OPA4350) packages are in the space-saving SSOP-16 surface mount and SO-14 surface mount. All are specified from −40°C to 85°C and operate from −55°C to 150°C.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
OPA350 MSOP (8) 3.00 mm × 3.00 mm
SOIC (8) 3.91 mm × 4.90 mm
PDIP (8) 6.35 mm × 9.81 mm
OPA2350 MSOP (8) 3.00 mm × 3.00 mm
SOIC (8) 3.91 mm × 4.90 mm
PDIP (8) 6.35 mm × 9.81 mm
OPA4350 SSOP (16) 3.90 mm × 4.90 mm
SOIC (14) 3.91 mm × 8.65 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

4 Revision History

Changes from C Revision (January 2005) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. Go