SBOS153B September 2000  – January 2016 OPA541

PRODUCTION DATA. 

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1Absolute Maximum Ratings
    2. 6.2ESD Ratings
    3. 6.3Recommended Operating Conditions
    4. 6.4Thermal Information
    5. 6.5Electrical Characteristics
    6. 6.6Typical Characteristics
  7. Detailed Description
    1. 7.1Overview
    2. 7.2Functional Block Diagram
    3. 7.3Feature Description
    4. 7.4Device Functional Modes
  8. Application and Implementation
    1. 8.1Application Information
      1. 8.1.1Current Limit
      2. 8.1.2Heat Sinking
      3. 8.1.3Safe Operating Area
      4. 8.1.4Replacing Hybrid Power Amplifiers
    2. 8.2Typical Applications
      1. 8.2.1Clamping Output for EMF-Generating Loads
        1. 8.2.1.1Design Requirements
        2. 8.2.1.2Detailed Design Procedure
          1. 8.2.1.2.1Power Supply Requirements
          2. 8.2.1.2.2Current Limit and SOA (Safe Operating Area)
          3. 8.2.1.2.3Heat Sinking
        3. 8.2.1.3Application Curve
      2. 8.2.2Paralleled Operation, Extended SOA
        1. 8.2.2.1Design Requirements
      3. 8.2.3Programmable Voltage Source
        1. 8.2.3.1Design Requirements
      4. 8.2.416-Bit Programmable Voltage Source
        1. 8.2.4.1Design Requirements
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1Layout Guidelines
    2. 10.2Layout Example
  11. 11Device and Documentation Support
    1. 11.1Documentation Support
      1. 11.1.1Related Documentation
    2. 11.2Community Resources
    3. 11.3Trademarks
    4. 11.4Electrostatic Discharge Caution
    5. 11.5Glossary
  12. 12Mechanical, Packaging, and Orderable Information

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

  • Heat Sinking — TO-3 Thermal Model, SBOA021.
  • Power Amplifier Stress and Power Handling Limitations, SBOA022.

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.