SBOS153B September 2000  – January 2016 OPA541

PRODUCTION DATA. 

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1Absolute Maximum Ratings
    2. 6.2ESD Ratings
    3. 6.3Recommended Operating Conditions
    4. 6.4Thermal Information
    5. 6.5Electrical Characteristics
    6. 6.6Typical Characteristics
  7. Detailed Description
    1. 7.1Overview
    2. 7.2Functional Block Diagram
    3. 7.3Feature Description
    4. 7.4Device Functional Modes
  8. Application and Implementation
    1. 8.1Application Information
      1. 8.1.1Current Limit
      2. 8.1.2Heat Sinking
      3. 8.1.3Safe Operating Area
      4. 8.1.4Replacing Hybrid Power Amplifiers
    2. 8.2Typical Applications
      1. 8.2.1Clamping Output for EMF-Generating Loads
        1. 8.2.1.1Design Requirements
        2. 8.2.1.2Detailed Design Procedure
          1. 8.2.1.2.1Power Supply Requirements
          2. 8.2.1.2.2Current Limit and SOA (Safe Operating Area)
          3. 8.2.1.2.3Heat Sinking
        3. 8.2.1.3Application Curve
      2. 8.2.2Paralleled Operation, Extended SOA
        1. 8.2.2.1Design Requirements
      3. 8.2.3Programmable Voltage Source
        1. 8.2.3.1Design Requirements
      4. 8.2.416-Bit Programmable Voltage Source
        1. 8.2.4.1Design Requirements
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1Layout Guidelines
    2. 10.2Layout Example
  11. 11Device and Documentation Support
    1. 11.1Documentation Support
      1. 11.1.1Related Documentation
    2. 11.2Community Resources
    3. 11.3Trademarks
    4. 11.4Electrostatic Discharge Caution
    5. 11.5Glossary
  12. 12Mechanical, Packaging, and Orderable Information

10 Layout

10.1 Layout Guidelines

Figure 18 provides the recommended solder footprint for the TO-220 power package. The tab is electrically connected to the negative supply, V–. It may be desirable to isolate the tab of the TO-220 package from its mounting surface with a mica (or other film) insulator. For lowest overall thermal resistance, it is best to isolate the entire heat sink or OPA541 structure from the mounting surface rather than to use an insulator between the semiconductor and heat sink.

10.2 Layout Example

OPA541 OPA541layout_sbos153.gif Figure 18. Recommended Layout