SLOS712I January 2011  – October 2016 OPA2836 , OPA836


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. OPA836-Related Devices
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1Absolute Maximum Ratings
    2. 7.2ESD Ratings
    3. 7.3Recommended Operating Conditions
    4. 7.4Thermal Information: OPA836
    5. 7.5Thermal Information: OPA2836
    6. 7.6Electrical Characteristics: VS = 2.7 V
    7. 7.7Electrical Characteristics: VS = 5 V
    8. 7.8Typical Characteristics
      1. 7.8.1Typical Characteristics: VS = 2.7 V
      2. 7.8.2Typical Performance Graphs: VS = 5 V
  8. Detailed Description
    1. 8.1Overview
    2. 8.2Functional Block Diagrams
    3. 8.3Feature Description
      1. 8.3.1Input Common-Mode Voltage Range
      2. 8.3.2Output Voltage Range
      3. 8.3.3Power-Down Operation
      4. 8.3.4Low-Power Applications and the Effects of Resistor Values on Bandwidth
      5. 8.3.5Driving Capacitive Loads
    4. 8.4Device Functional Modes
      1. 8.4.1Split-Supply Operation (±1.25 V to ±2.75 V)
      2. 8.4.2Single-Supply Operation (2.5 V to 5.5 V)
  9. Application and Implementation
    1. 9.1Application Information
      1. 9.1.1 Noninverting Amplifier
      2. 9.1.2 Inverting Amplifier
      3. 9.1.3 Instrumentation Amplifier
      4. 9.1.4 Attenuators
      5. 9.1.5 Single-Ended-to-Differential Amplifier
      6. 9.1.6 Differential-to-Signal-Ended Amplifier
      7. 9.1.7 Differential-to-Differential Amplifier
      8. 9.1.8 Gain Setting With OPA836 RUN Integrated Resistors
      9. 9.1.9 Pulse Application With Single-Supply
      10. 9.1.10ADC Driver Performance
    2. 9.2Typical Applications
      1. 9.2.1Audio Frequency Performance
        1. Requirements
        2. Design Procedure
        3. Curves
      2. 9.2.2Active Filters
        1. Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1Layout Guidelines
    2. 11.2Layout Example
  12. 12Device and Documentation Support
    1. 12.1Device Support
      1. 12.1.1Development Support
      2. 12.1.2Related Documentation
    2. 12.2Related Links
    3. 12.3Receiving Notification of Documentation Updates
    4. 12.4Community Resources
    5. 12.5Trademarks
    6. 12.6Electrostatic Discharge Caution
    7. 12.7Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Orderable Information

Device and Documentation Support

Device Support

Development Support

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Related Documentation

For related documentation see the following:


Related Links

Table 7 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 7. Related Links

OPA836Click hereClick hereClick hereClick hereClick here
OPA2836Click hereClick hereClick hereClick hereClick here

Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.


E2E is a trademark of Texas Instruments.

WEBENCH is a registered trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

Electrostatic Discharge Caution


This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.


SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.