SBOS745A May 2016  – June 2016 OPT3002

PRODUCTION DATA. 

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1Absolute Maximum Ratings
    2. 6.2ESD Ratings
    3. 6.3Recommended Operating Conditions
    4. 6.4Thermal Information
    5. 6.5Electrical Characteristics
    6. 6.6Timing Requirements
    7. 6.7Typical Characteristics
  7. Detailed Description
    1. 7.1Overview
    2. 7.2Functional Block Diagram
    3. 7.3Feature Description
      1. 7.3.1Automatic Full-Scale Range Setting
      2. 7.3.2Interrupt Operation, INT Pin, and Interrupt Reporting Mechanisms
      3. 7.3.3I2C Bus Overview
        1. 7.3.3.1Serial Bus Address
        2. 7.3.3.2Serial Interface
    4. 7.4Device Functional Modes
      1. 7.4.1Automatic Full-Scale Setting Mode
      2. 7.4.2Interrupt Reporting Mechanism Modes
        1. 7.4.2.1Latched Window-Style Comparison Mode
        2. 7.4.2.2Transparent Hysteresis-Style Comparison Mode
        3. 7.4.2.3End-of-Conversion Mode
        4. 7.4.2.4End-of-Conversion and Transparent Hysteresis-Style Comparison Mode
    5. 7.5Programming
      1. 7.5.1Writing and Reading
        1. 7.5.1.1High-Speed I2C Mode
        2. 7.5.1.2General-Call Reset Command
        3. 7.5.1.3SMBus Alert Response
    6. 7.6Register Maps
      1. 7.6.1Internal Registers
        1. 7.6.1.1Register Descriptions
          1. 7.6.1.1.1Result Register (address = 00h)
          2. 7.6.1.1.2Configuration Register (address = 01h) [reset = C810h]
          3. 7.6.1.1.3Low-Limit Register (address = 02h) [reset = C0000h]
          4. 7.6.1.1.4High-Limit Register (address = 03h) [reset = BFFFh]
          5. 7.6.1.1.5Manufacturer ID Register (address = 7Eh) [reset = 5449h]
  8. Application and Implementation
    1. 8.1Application Information
      1. 8.1.1Electrical Interface
      2. 8.1.2Optical Interface
      3. 8.1.3Compensation for the Spectral Response
    2. 8.2Do's and Don'ts
  9. Power-Supply Recommendations
  10. 10Layout
    1. 10.1Layout Guidelines
    2. 10.2Layout Example
  11. 11Device and Documentation Support
    1. 11.1Documentation Support
      1. 11.1.1Related Documentation
    2. 11.2Receiving Notification of Documentation Updates
    3. 11.3Community Resources
    4. 11.4Trademarks
    5. 11.5Electrostatic Discharge Caution
    6. 11.6Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1Soldering and Handling Recommendations
    2. 12.2DNP (S-PDSO-N6) Mechanical Drawings

Device and Documentation Support

Documentation Support

Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.