SBOS745A May 2016  – June 2016 OPT3002

PRODUCTION DATA. 

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1Absolute Maximum Ratings
    2. 6.2ESD Ratings
    3. 6.3Recommended Operating Conditions
    4. 6.4Thermal Information
    5. 6.5Electrical Characteristics
    6. 6.6Timing Requirements
    7. 6.7Typical Characteristics
  7. Detailed Description
    1. 7.1Overview
    2. 7.2Functional Block Diagram
    3. 7.3Feature Description
      1. 7.3.1Automatic Full-Scale Range Setting
      2. 7.3.2Interrupt Operation, INT Pin, and Interrupt Reporting Mechanisms
      3. 7.3.3I2C Bus Overview
        1. 7.3.3.1Serial Bus Address
        2. 7.3.3.2Serial Interface
    4. 7.4Device Functional Modes
      1. 7.4.1Automatic Full-Scale Setting Mode
      2. 7.4.2Interrupt Reporting Mechanism Modes
        1. 7.4.2.1Latched Window-Style Comparison Mode
        2. 7.4.2.2Transparent Hysteresis-Style Comparison Mode
        3. 7.4.2.3End-of-Conversion Mode
        4. 7.4.2.4End-of-Conversion and Transparent Hysteresis-Style Comparison Mode
    5. 7.5Programming
      1. 7.5.1Writing and Reading
        1. 7.5.1.1High-Speed I2C Mode
        2. 7.5.1.2General-Call Reset Command
        3. 7.5.1.3SMBus Alert Response
    6. 7.6Register Maps
      1. 7.6.1Internal Registers
        1. 7.6.1.1Register Descriptions
          1. 7.6.1.1.1Result Register (address = 00h)
          2. 7.6.1.1.2Configuration Register (address = 01h) [reset = C810h]
          3. 7.6.1.1.3Low-Limit Register (address = 02h) [reset = C0000h]
          4. 7.6.1.1.4High-Limit Register (address = 03h) [reset = BFFFh]
          5. 7.6.1.1.5Manufacturer ID Register (address = 7Eh) [reset = 5449h]
  8. Application and Implementation
    1. 8.1Application Information
      1. 8.1.1Electrical Interface
      2. 8.1.2Optical Interface
      3. 8.1.3Compensation for the Spectral Response
    2. 8.2Do's and Don'ts
  9. Power-Supply Recommendations
  10. 10Layout
    1. 10.1Layout Guidelines
    2. 10.2Layout Example
  11. 11Device and Documentation Support
    1. 11.1Documentation Support
      1. 11.1.1Related Documentation
    2. 11.2Receiving Notification of Documentation Updates
    3. 11.3Community Resources
    4. 11.4Trademarks
    5. 11.5Electrostatic Discharge Caution
    6. 11.6Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1Soldering and Handling Recommendations
    2. 12.2DNP (S-PDSO-N6) Mechanical Drawings

Layout

Layout Guidelines

The PCB layout design for the OPT3002 requires a couple of considerations. Bypass the power supply with a capacitor placed close to the OPT3002. Note that optically reflective surfaces of components also affect the performance of the design. The three-dimensional geometry of all components and structures around the sensor must be taken into consideration to prevent unexpected results from secondary optical reflections. Placing capacitors and components at a distance of at least twice the height of the component is usually sufficient. The most optimal optical layout is to place all close components on the opposite side of the PCB from the OPT3002. However, this approach may not be practical for the constraints of every design.

Electrically connecting the thermal pad to ground is recommended. This connection can be created either with a PCB trace or with vias to ground directly on the thermal pad itself. If the thermal pad contains vias, they are recommended to be of a small diameter (< 0.2 mm) to prevent them from wicking the solder away from the appropriate surfaces.

An example PCB layout with the OPT3002 is shown in Figure 24.

Layout Example

OPT3002 ai_layout_sbos745.gif Figure 24. Example PCB Layout with the OPT3002