SBOS745A May 2016  – June 2016 OPT3002

PRODUCTION DATA. 

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1Absolute Maximum Ratings
    2. 6.2ESD Ratings
    3. 6.3Recommended Operating Conditions
    4. 6.4Thermal Information
    5. 6.5Electrical Characteristics
    6. 6.6Timing Requirements
    7. 6.7Typical Characteristics
  7. Detailed Description
    1. 7.1Overview
    2. 7.2Functional Block Diagram
    3. 7.3Feature Description
      1. 7.3.1Automatic Full-Scale Range Setting
      2. 7.3.2Interrupt Operation, INT Pin, and Interrupt Reporting Mechanisms
      3. 7.3.3I2C Bus Overview
        1. 7.3.3.1Serial Bus Address
        2. 7.3.3.2Serial Interface
    4. 7.4Device Functional Modes
      1. 7.4.1Automatic Full-Scale Setting Mode
      2. 7.4.2Interrupt Reporting Mechanism Modes
        1. 7.4.2.1Latched Window-Style Comparison Mode
        2. 7.4.2.2Transparent Hysteresis-Style Comparison Mode
        3. 7.4.2.3End-of-Conversion Mode
        4. 7.4.2.4End-of-Conversion and Transparent Hysteresis-Style Comparison Mode
    5. 7.5Programming
      1. 7.5.1Writing and Reading
        1. 7.5.1.1High-Speed I2C Mode
        2. 7.5.1.2General-Call Reset Command
        3. 7.5.1.3SMBus Alert Response
    6. 7.6Register Maps
      1. 7.6.1Internal Registers
        1. 7.6.1.1Register Descriptions
          1. 7.6.1.1.1Result Register (address = 00h)
          2. 7.6.1.1.2Configuration Register (address = 01h) [reset = C810h]
          3. 7.6.1.1.3Low-Limit Register (address = 02h) [reset = C0000h]
          4. 7.6.1.1.4High-Limit Register (address = 03h) [reset = BFFFh]
          5. 7.6.1.1.5Manufacturer ID Register (address = 7Eh) [reset = 5449h]
  8. Application and Implementation
    1. 8.1Application Information
      1. 8.1.1Electrical Interface
      2. 8.1.2Optical Interface
      3. 8.1.3Compensation for the Spectral Response
    2. 8.2Do's and Don'ts
  9. Power-Supply Recommendations
  10. 10Layout
    1. 10.1Layout Guidelines
    2. 10.2Layout Example
  11. 11Device and Documentation Support
    1. 11.1Documentation Support
      1. 11.1.1Related Documentation
    2. 11.2Receiving Notification of Documentation Updates
    3. 11.3Community Resources
    4. 11.4Trademarks
    5. 11.5Electrostatic Discharge Caution
    6. 11.6Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1Soldering and Handling Recommendations
    2. 12.2DNP (S-PDSO-N6) Mechanical Drawings

Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

Soldering and Handling Recommendations

The OPT3002 is qualified for three soldering reflow operations as per JEDEC JSTD-020.

Note that excessive heat can discolor the device and affect optical performance.

See application report QFN/SON PCB Attachment for details on the soldering thermal profile and other information. If the OPT3002 must be removed from a PCB, discard the device and do not reattach.

As with most optical devices, handle the OPT3002 with special care to ensure optical surfaces stay clean and free from damage. See the Do's and Don'ts section for more detailed recommendations. For best optical performance, solder flux and any other possible debris must be cleaned after soldering processes.

DNP (S-PDSO-N6) Mechanical Drawings

OPT3002 pin1_sbos681.gif Figure 25. Package Orientation Visual Reference of Pin 1
(Top View)
OPT3002 sensor_location_sbos681.gif Figure 26. Mechanical Outline Showing Sensing Area Location
(Top and Side Views)