SBOS698
October 2016
OPT3006
PRODUCTION DATA.
1
Features
2
Applications
3
Description
4
Revision History
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Timing Requirements
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Human Eye Matching
7.3.2
Automatic Full-Scale Range Setting
7.3.3
Interrupt Operation, INT Pin, and Interrupt Reporting Mechanisms
7.3.4
I2C Bus Overview
7.3.4.1
Serial Bus Address
7.3.4.2
Serial Interface
7.4
Device Functional Modes
7.4.1
Automatic Full-Scale Setting Mode
7.4.2
Interrupt Reporting Mechanism Modes
7.4.2.1
Latched Window-Style Comparison Mode
7.4.2.2
Transparent Hysteresis-Style Comparison Mode
7.4.2.3
End-of-Conversion Mode
7.4.2.4
End-of-Conversion and Transparent Hysteresis-Style Comparison Mode
7.5
Programming
7.5.1
Writing and Reading
7.5.1.1
High-Speed I2C Mode
7.5.1.2
General-Call Reset Command
7.5.1.3
SMBus Alert Response
7.6
Register Maps
7.6.1
Internal Registers
7.6.1.1
Register Descriptions
7.6.1.1.1
Result Register (offset = 00h)
7.6.1.1.2
Configuration Register (offset = 01h) [reset = C810h]
7.6.1.1.3
Low-Limit Register (offset = 02h) [reset = C0000h]
7.6.1.1.4
High-Limit Register (offset = 03h) [reset = BFFFh]
7.6.1.1.5
Manufacturer ID Register (offset = 7Eh) [reset = 5449h]
7.6.1.1.6
Device ID Register (offset = 7Fh) [reset = 3001h]
8
Application and Implementation
8.1
Application Information
8.1.1
Electrical Interface
8.1.2
Optical Interface
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.2.1
Optomechanical Design
8.2.3
Application Curves
8.3
Do's and Don'ts
9
Power-Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Soldering and Handling Recommendations
10.2.1
Solder Paste
10.2.2
Package Placement
10.2.3
Reflow Profile
10.2.4
Special Flexible Printed Circuit Board (FPCB) Recommendations
10.2.5
Rework Process
10.3
Layout Example
11
Device and Documentation Support
11.1
Documentation Support
11.1.1
Related Documentation
11.2
Receiving Notification of Documentation Updates
11.3
Community Resources
11.4
Trademarks
11.5
Electrostatic Discharge Caution
11.6
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
YMF|6
MXLG034
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbos698_oa
sbos698_pm