SLAS916C
November 2012 – November 2014
RF430CL330H
PRODUCTION DATA.
1
Device Overview
1.1
Features
1.2
Applications
1.3
Description
1.4
Typical Application Diagram
2
Revision History
3
Terminal Configuration and Functions
4
Specifications
4.1
Absolute Maximum Ratings
4.2
Handling Ratings
4.3
Recommended Operating Conditions
4.4
Recommended Operating Conditions, Resonant Circuit
4.5
Supply Currents
4.6
Digital Inputs
4.7
Digital Outputs
4.8
Thermal Characteristics
4.9
Serial Communication Protocol Timings
4.10
I2C Interface
4.11
SPI Interface
4.12
RF143B, Recommended Operating Conditions
4.13
RF143B, ISO14443B ASK Demodulator
4.14
RF143B, ISO14443B-Compliant Load Modulator
4.15
RF143B, Power Supply
5
Detailed Description
5.1
Functional Block Diagram
5.2
Serial Communication Interface
5.3
SPI or I2C Mode Selection
5.4
Communication Protocol
5.5
I2C Protocol
5.5.1
BIP-8 Communication Mode With I2C
5.6
SPI Protocol
5.6.1
BIP-8 Communication Mode With SPI
5.7
Registers
5.7.1
General Control Register
5.7.2
Status Register
5.7.3
Interrupt Registers
5.7.4
CRC Registers
5.7.5
Communication Watchdog Register
5.7.6
Version Registers
5.8
NFC Type-4 Tag Functionality
5.8.1
ISO14443-3 Commands
5.8.2
NFC Tag Type 4 Commands
5.8.3
Data Rate Settings
5.9
NDEF Memory
5.9.1
NDEF Error Check
5.10
Typical Usage Scenario
5.11
References
6
Device and Documentation Support
6.1
Device Support
6.1.1
Development Support
6.1.1.1
Getting Started and Next Steps
6.1.2
Device and Development Tool Nomenclature
6.2
Documentation Support
6.3
Community Resources
6.4
Trademarks
6.5
Electrostatic Discharge Caution
6.6
Glossary
7
Mechanical Packaging and Orderable Information
7.1
Packaging Information
Package Options
Mechanical Data (Package|Pins)
PW|14
MPDS360
RGT|16
MPQF119H
Thermal pad, mechanical data (Package|Pins)
PW|14
QFND305D
RGT|16
QFND098S
Orderable Information
slas916c_oa
slas916c_pm