SLAS916C November   2012  – November 2014 RF430CL330H

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
    4. 1.4 Typical Application Diagram
  2. 2Revision History
  3. 3Terminal Configuration and Functions
  4. 4Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  Handling Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Recommended Operating Conditions, Resonant Circuit
    5. 4.5  Supply Currents
    6. 4.6  Digital Inputs
    7. 4.7  Digital Outputs
    8. 4.8  Thermal Characteristics
    9. 4.9  Serial Communication Protocol Timings
    10. 4.10 I2C Interface
    11. 4.11 SPI Interface
    12. 4.12 RF143B, Recommended Operating Conditions
    13. 4.13 RF143B, ISO14443B ASK Demodulator
    14. 4.14 RF143B, ISO14443B-Compliant Load Modulator
    15. 4.15 RF143B, Power Supply
  5. 5Detailed Description
    1. 5.1  Functional Block Diagram
    2. 5.2  Serial Communication Interface
    3. 5.3  SPI or I2C Mode Selection
    4. 5.4  Communication Protocol
    5. 5.5  I2C Protocol
      1. 5.5.1 BIP-8 Communication Mode With I2C
    6. 5.6  SPI Protocol
      1. 5.6.1 BIP-8 Communication Mode With SPI
    7. 5.7  Registers
      1. 5.7.1 General Control Register
      2. 5.7.2 Status Register
      3. 5.7.3 Interrupt Registers
      4. 5.7.4 CRC Registers
      5. 5.7.5 Communication Watchdog Register
      6. 5.7.6 Version Registers
    8. 5.8  NFC Type-4 Tag Functionality
      1. 5.8.1 ISO14443-3 Commands
      2. 5.8.2 NFC Tag Type 4 Commands
      3. 5.8.3 Data Rate Settings
    9. 5.9  NDEF Memory
      1. 5.9.1 NDEF Error Check
    10. 5.10 Typical Usage Scenario
    11. 5.11 References
  6. 6Device and Documentation Support
    1. 6.1 Device Support
      1. 6.1.1 Development Support
        1. 6.1.1.1 Getting Started and Next Steps
      2. 6.1.2 Device and Development Tool Nomenclature
    2. 6.2 Documentation Support
    3. 6.3 Community Resources
    4. 6.4 Trademarks
    5. 6.5 Electrostatic Discharge Caution
    6. 6.6 Glossary
  7. 7Mechanical Packaging and Orderable Information
    1. 7.1 Packaging Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Terminal Configuration and Functions

Figure 3-1 shows the pin assignments for the PW package.

pinout_pw14_slas850.gifFigure 3-1 14-Pin PW Package (Top View)

Figure 3-2 shows the pin assignments for the RGT package.

pinout_rgt16_slas850.gifFigure 3-2 16-Pin RGT Package (Top View)

Table 3-1 Terminal Functions

TERMINAL I/O DESCRIPTION
NAME NO.
PW RGT
VCC 1 15 PWR

3.3-V power supply
ANT1 2 1 RF

Antenna input 1
ANT2 3 2 RF

Antenna input 2
RST 4 3 I

Reset input (active low)

E0 (TMS) 5 4 I

I2C address select 0

SPI mode select 0

(JTAG test mode select)
E1 (TDO) 6 5 I (O)

I2C address select 1

SPI mode select 1

(JTAG test data output)
E2 (TDI) 7 6 I

I2C address select 2

(JTAG test data in)
INTO (TCK) 8 7 O

Interrupt output

(JTAG test clock)

SCMS/

CS

9 8 I

Serial Communication Mode Select (during device initialization)

Chip select (in SPI mode)
SCK 10 9 I

SPI clock input (SPI mode)
SO/SCL 11 10 I/O

SPI slave out (SPI mode)

I2C clock (I2C mode)
SI/SDA 12 11 I/O

SPI slave in (SPI mode)

I2C data (I2C mode)
VCORE 13 12 PWR

Regulated core supply voltage
VSS 14 13 PWR

Ground supply
NC - 14, 16 Leave open, No connection
app_dgm_i2c_slas850.gif
For recommended capacitance values, see Recommended Operating Conditions.
Figure 3-3 Example Application Diagram (I2C Operation) (PW Package Shown)
app_dgm_spi_slas850.gif
For recommended capacitance values, see Recommended Operating Conditions.
Figure 3-4 Example Application Diagram (SPI Operation) (PW Package Shown)