SLOS913A October   2015  – February 2017 SN55HVD75-EP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics: 20 Mbps Device, Bit Time ≥50 ns
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Data Rate and Bus Length
        2. 9.2.1.2 Stub Length
        3. 9.2.1.3 Bus Loading
        4. 9.2.1.4 Receiver Failsafe
        5. 9.2.1.5 Transient Protection
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 External Transient Protection
        2. 9.2.2.2 Isolated Bus Node Design
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Bus I/O Protection
    • >±15-kV HBM Protection
    • >±12-kV IEC 61000-4-2 Contact Discharge
    • >±4-kV IEC 61000-4-4 Fast Transient Burst
  • Extended Industrial Temperature Range
    –55°C to 125°C
  • Large Receiver Hysteresis (80 mV) for Noise Rejection
  • Low-Unit-Loading Allows Over 200 Connected Nodes
  • Low-Power Consumption
    • Low-Standby Supply Current: < 2 µA
    • ICC < 1-mA Quiescent During Operation
  • 5-V Tolerant Logic Inputs Compatible With
    3.3-V or 5-V Controllers
  • Signaling Rate Options Optimized for:
    250 kbps, 20 Mbps, 50 Mbps
  • Available in a Small VSON Package
  • Supports Defense, Aerospace, and Medical Applications:
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Available in Extended (–55°C to 125°C) Temperature Range
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability

2 Applications

  • Factory Automation
  • Telecommunications Infrastructure
  • Motion Control

3 Description

These devices have robust 3.3-V drivers and receivers in a small package for demanding industrial applications. The bus pins are robust to ESD events with high levels of protection to human-body model and IEC contact discharge specifications.

Each of these devices combines a differential driver and a differential receiver which operate from a single 3.3-V power supply. The driver differential outputs and the receiver differential inputs are connected internally to form a bus port suitable for half-duplex (two-wire bus) communication. These devices feature a wide common-mode voltage range making the devices suitable for multi-point applications over long cable runs. These devices are characterized from –55°C to 125°C.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
SN55HVD75-EP VSON (8) 3.00 mm × 3.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Typical Application Diagram

SN55HVD75-EP ntwrk_app_llse11.gif