SN74AHC16374

ACTIVE

Product details

Number of channels 16 Technology family AHC Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Input type Standard CMOS Output type 3-State Clock frequency (max) (MHz) 110 IOL (max) (mA) 8 IOH (max) (mA) -8 Supply current (max) (µA) 40 Features Balanced outputs, High speed (tpd 10-50ns), Over-voltage tolerant inputs Operating temperature range (°C) -40 to 85 Rating Catalog
Number of channels 16 Technology family AHC Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Input type Standard CMOS Output type 3-State Clock frequency (max) (MHz) 110 IOL (max) (mA) 8 IOH (max) (mA) -8 Supply current (max) (µA) 40 Features Balanced outputs, High speed (tpd 10-50ns), Over-voltage tolerant inputs Operating temperature range (°C) -40 to 85 Rating Catalog
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1 TVSOP (DGV) 48 62.08 mm² 9.7 x 6.4
  • Members of the Texas Instruments WidebusTM Family
  • EPICTM (Enhanced-Performance Implanted CMOS) Process
  • Operating Range 2-V to 5.5-V VCC
  • 3-State Outputs Drive Bus Lines Directly
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

  • Members of the Texas Instruments WidebusTM Family
  • EPICTM (Enhanced-Performance Implanted CMOS) Process
  • Operating Range 2-V to 5.5-V VCC
  • 3-State Outputs Drive Bus Lines Directly
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

The 'AHC16374 devices are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

These devices can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels at the data (D) inputs.

A buffered output-enable (OE\) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

OE\ does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The SN54AHC16374 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AHC16374 is characterized for operation from -40°C to 85°C.

The 'AHC16374 devices are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.

These devices can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels at the data (D) inputs.

A buffered output-enable (OE\) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus lines without need for interface or pullup components.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

OE\ does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.

The SN54AHC16374 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AHC16374 is characterized for operation from -40°C to 85°C.

Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Pin-for-pin with same functionality to the compared device
74AC16374 ACTIVE 16-Bit Edge-Triggered D-Type Flip-Flops With 3-State Outputs Shorter average propagation delay (7ns), higher average drive strength (24mA)

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 21
Type Title Date
* Data sheet 16-Bit Edge-Triggered D-Type Flip-Flops With 3-State Outputs datasheet (Rev. G) 25 Jan 2000
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 15 Dec 2022
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
Application note Advanced High-Speed CMOS (AHC) Logic Family (Rev. C) 02 Dec 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Design guide AHC/AHCT Designer's Guide February 2000 (Rev. D) 24 Feb 2000
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) 08 Sep 1999
Product overview Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C) 01 Apr 1998
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note Live Insertion 01 Oct 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins Download
SSOP (DL) 48 View options
TSSOP (DGG) 48 View options
TVSOP (DGV) 48 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos