SN74BCT25244

ACTIVE

Product details

Technology family BCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 188 Supply current (max) (µA) 119000 IOH (max) (mA) -80 Input type Bipolar Output type 3-State Features Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) 0 to 70
Technology family BCT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 188 Supply current (max) (µA) 119000 IOH (max) (mA) -80 Input type Bipolar Output type 3-State Features Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) 0 to 70
SOIC (DW) 24 159.65 mm² 15.5 x 10.3
  • State-of-the-Art BiCMOS Design Significantly Reduces ICCZ
  • ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Designed to Facilitate Incident-Wave Switching for Line Impedances of 25 or Greater
  • Distributed VCC and GND Pins Minimize Noise Generated by the Simultaneous Switching of Outputs
  • Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic and Ceramic 300-mil DIPs (JT, NT)

 

  • State-of-the-Art BiCMOS Design Significantly Reduces ICCZ
  • ESD Protection Exceeds 2000 V Per MIL-STD-883C, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Designed to Facilitate Incident-Wave Switching for Line Impedances of 25 or Greater
  • Distributed VCC and GND Pins Minimize Noise Generated by the Simultaneous Switching of Outputs
  • Package Options Include Plastic Small-Outline (DW) Packages, Ceramic Chip Carriers (FK) and Flatpacks (W), and Standard Plastic and Ceramic 300-mil DIPs (JT, NT)

 

These 25- octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

These buffers are capable of sinking 188-mA IOL, which facilitates switching 25- transmission lines on the incident wave. The distributed VCC and GND pins minimize switching noise for more reliable system operation.

When the output-enable (1 and 2) inputs are low, the device transmits data from the A inputs to the Y outputs. When 1 and 2 are high, the outputs are in the high-impedance state.

The SN54BCT25244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74BCT25244 is characterized for operation from 0°C to 70°C.

 

 

These 25- octal buffers and line drivers are designed specifically to improve both the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

These buffers are capable of sinking 188-mA IOL, which facilitates switching 25- transmission lines on the incident wave. The distributed VCC and GND pins minimize switching noise for more reliable system operation.

When the output-enable (1 and 2) inputs are low, the device transmits data from the A inputs to the Y outputs. When 1 and 2 are high, the outputs are in the high-impedance state.

The SN54BCT25244 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74BCT25244 is characterized for operation from 0°C to 70°C.

 

 

Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Pin-for-pin with same functionality to the compared device
SN74AHCT244 ACTIVE 8-ch, 4.5-V to 5.5-V buffers with TTL-compatible CMOS inputs Larger voltage range (2V to 5.5V)

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 11
Type Title Date
* Data sheet 25-Ohm Line Drivers With 3-State Outputs datasheet (Rev. A) 01 Nov 1991
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note Designing With Logic (Rev. C) 01 Jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

14-24-LOGIC-EVM — Logic product generic evaluation module for 14-pin to 24-pin D, DB, DGV, DW, DYY, NS and PW packages

The 14-24-LOGIC-EVM evaluation module (EVM) is designed to support any logic device that is in a 14-pin to 24-pin D, DW, DB, NS, PW, DYY or DGV package,

User guide: PDF | HTML
Not available on TI.com
Simulation model

SN74BCT25244 Behavioral SPICE Model

SCBM128.ZIP (7 KB) - PSpice Model
Package Pins Download
SOIC (DW) 24 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos