SCES487H September   2003  – November 2016 SN74LVC1G11

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Switching Characteristics, CL = 15 pF, TA = -40°C to +85°C
    7. 6.7  Switching Characteristics, CL = 30 pF or 50 pF, TA = -40°C to +85°C
    8. 6.8  Switching Characteristics, CL = 30 pF or 50 pF, TA = -40°C to +125°C
    9. 6.9  Operating Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|6
  • DSF|6
  • YZP|6
  • DCK|6
  • DRY|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from G Revision (December 2015) to H Revision

  • Deleted 200-V Machine Model from Features Go
  • Changed pinout images to improve clarity of pin names and pin numbersGo
  • Added DSBGA pin numbers to Pin Functions table Go
  • Added Operating free-air temperature, TA for BGA packageGo
  • Added Receiving Notification of Documentation Updates sectionGo

Changes from F Revision (December2013) to G Revision

  • Added Applications section, Device Information table, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section.Go

Changes from E Revision (December 2011) to F Revision

  • Updated document to new TI data sheet format.Go
  • Removed Ordering Information table.Go
  • Updated operating temperature rangeGo

Changes from D Revision (January 2007) to E Revision

  • Added DRY and DSF packages to data sheet Go