Product details

Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 5.5 Number of channels 2 IOL (max) (mA) 32 IOH (max) (mA) -32 Supply current (max) (µA) 10 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 125
Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 5.5 Number of channels 2 IOL (max) (mA) 32 IOH (max) (mA) -32 Supply current (max) (µA) 10 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 125
DSBGA (YZP) 6 2.1875 mm² 1.75 x 1.25 SOT-23 (DBV) 6 8.12 mm² 2.9 x 2.8 SOT-SC70 (DCK) 6 4.2 mm² 2 x 2.1
  • Available in the TI NanoFree Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 5.4 ns at 3.3 V
  • Low-Power Consumption, 10-μA Maximum ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    >2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Support Translation Down
    (5 V to 3.3 V; 3.3 V to 1.8 V)
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II
  • Available in the TI NanoFree Package
  • Supports 5-V VCC Operation
  • Inputs Accept Voltages to 5.5 V
  • Max tpd of 5.4 ns at 3.3 V
  • Low-Power Consumption, 10-μA Maximum ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    >2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Support Translation Down
    (5 V to 3.3 V; 3.3 V to 1.8 V)
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II

This dual Schmitt-trigger inverter is designed for
1.65-V to 5.5-V VCC operation.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

The SN74LVC2G14 device contains two inverters and performs the Boolean function Y = A. The device functions as two independent inverters, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

For all available packages, see the orderable addendum at the end of the data sheet.

This dual Schmitt-trigger inverter is designed for
1.65-V to 5.5-V VCC operation.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

The SN74LVC2G14 device contains two inverters and performs the Boolean function Y = A. The device functions as two independent inverters, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

For all available packages, see the orderable addendum at the end of the data sheet.

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Technical documentation

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Type Title Date
* Data sheet SN74LVC2G14 Dual Schmitt-Trigger Inverter datasheet (Rev. O) PDF | HTML 10 Aug 2015
Product overview Generate a Power-On Reset Pulse PDF | HTML 14 Jun 2023
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Application brief Converting SPI to GPIO Through Digital Isolators PDF | HTML 16 Oct 2020
Application brief Understanding Schmitt Triggers (Rev. A) PDF | HTML 22 May 2019
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 Nov 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 Dec 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 May 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 May 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mar 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note LVC Characterization Information 01 Dec 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 Sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

5-8-LOGIC-EVM — Generic logic evaluation module for 5-pin to 8-pin DCK, DCT, DCU, DRL and DBV packages

Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
User guide: PDF
Not available on TI.com
Evaluation board

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The TMAG5110-5111EVM is a rotary encoding board with dual Hall latches that have separate circuitry for both quadrature (TMAG5110) and speed and direction (TMAG5111) implementations. There are two different magnets and two magnet placement options to highlight the dual-latch capability of pole (...)

User guide: PDF | HTML
Not available on TI.com
Simulation model

SN74LVC2G14 Behavioral SPICE Model

SCEM616.ZIP (7 KB) - PSpice Model
Simulation model

SN74LVC2G14 IBIS Model (Rev. B)

SCEM252B.ZIP (45 KB) - IBIS Model
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Design guide: PDF
Schematic: PDF
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Design guide: PDF
Schematic: PDF
Reference designs

TIDA-00641 — Dual High Resolution Micro-stepping Driver Reference Design

This reference design achieves a dual channel high resolution micro-stepping driver module using PWM current regulation method. Selectable micro-stepping level and current level is provided with the on-board switches. The PWM regulation scheme gives smooth phase current and ultra-low acoustic (...)
Test report: PDF
Schematic: PDF
Package Pins Download
DSBGA (YZP) 6 View options
SOT-23 (DBV) 6 View options
SOT-SC70 (DCK) 6 View options

Ordering & quality

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  • MSL rating/Peak reflow
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  • Ongoing reliability monitoring
Information included:
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Support & training

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