SLOS870B September 2016  – October 2017 TAS6424-Q1

PRODUCTION DATA. 

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1Absolute Maximum Ratings
    2. 7.2ESD Ratings
    3. 7.3Recommended Operating Conditions
    4. 7.4Thermal Information
    5. 7.5Electrical Characteristics
    6. 7.6Timing Requirements
    7. 7.7Typical Characteristics
  8. Parameter measurement Information
  9. Detailed description
    1. 9.1Overview
    2. 9.2Functional Block Diagram
    3. 9.3Feature Description
      1. 9.3.1 Serial Audio Port
        1. 9.3.1.1 I2S Mode
        2. 9.3.1.2Left-Justified Timing
        3. 9.3.1.3Right-Justified Timing
        4. 9.3.1.4TDM Mode
        5. 9.3.1.5Supported Clock Rates
        6. 9.3.1.6Audio-Clock Error Handling
      2. 9.3.2 High-Pass Filter
      3. 9.3.3 Volume Control and Gain
      4. 9.3.4 High-Frequency Pulse-Width Modulator (PWM)
      5. 9.3.5 Gate Drive
      6. 9.3.6 Power FETs
      7. 9.3.7 Load Diagnostics
        1. 9.3.7.1DC Load Diagnostics
        2. 9.3.7.2Line Output Diagnostics
        3. 9.3.7.3AC Load Diagnostics
      8. 9.3.8 Protection and Monitoring
        1. 9.3.8.1Overcurrent Limit (ILIMIT)
        2. 9.3.8.2Overcurrent Shutdown (ISD)
        3. 9.3.8.3DC Detect
        4. 9.3.8.4Clip Detect
        5. 9.3.8.5Global Overtemperature Warning (OTW), Overtemperature Shutdown (OTSD)
        6. 9.3.8.6Channel Overtemperature Warning [OTW(i)] and Shutdown [OTSD(i)]
        7. 9.3.8.7Undervoltage (UV) and Power-On-Reset (POR)
        8. 9.3.8.8Overvoltage (OV) and Load Dump
      9. 9.3.9 Power Supply
        1. 9.3.9.1Vehicle-Battery Power-Supply Sequence
        2. 9.3.9.2Boosted Power-Supply Sequence
      10. 9.3.10Hardware Control Pins
        1. 9.3.10.1FAULT
        2. 9.3.10.2WARN
        3. 9.3.10.3MUTE
        4. 9.3.10.4STANDBY
    4. 9.4Device Functional Modes
      1. 9.4.1Operating Modes and Faults
    5. 9.5Programming
      1. 9.5.1I2C Serial Communication Bus
      2. 9.5.2I2C Bus Protocol
      3. 9.5.3Random Write
      4. 9.5.4Sequential Write
      5. 9.5.5Random Read
      6. 9.5.6Sequential Read
    6. 9.6Register Maps
      1. 9.6.1 Mode Control Register (address = 0x00) [default = 0x00]
      2. 9.6.2 Miscellaneous Control 1 Register (address = 0x01) [default = 0x32]
      3. 9.6.3 Miscellaneous Control 2 Register (address = 0x02) [default = 0x62]
      4. 9.6.4 SAP Control (Serial Audio-Port Control) Register (address = 0x03) [default = 0x04]
      5. 9.6.5 Channel State Control Register (address = 0x04) [default = 0x55]
      6. 9.6.6 Channel 1 Through 4 Volume Control Registers (address = 0x05-0x088) [default = 0xCF]
      7. 9.6.7 DC Load Diagnostic Control 1 Register (address = 0x09) [default = 0x00]
      8. 9.6.8 DC Load Diagnostic Control 2 Register (address = 0x0A) [default = 0x11]
      9. 9.6.9 DC Load Diagnostic Control 3 Register (address = 0x0B) [default = 0x11]
      10. 9.6.10DC Load Diagnostic Report 1 Register (address = 0x0C) [default = 0x00]
      11. 9.6.11DC Load Diagnostic Report 2 Register (address = 0x0D) [default = 0x00]
      12. 9.6.12DC Load Diagnostics Report 3—Line Output—Register (address = 0x0E) [default = 0x00]
      13. 9.6.13Channel State Reporting Register (address = 0x0F) [default = 0x55]
      14. 9.6.14Channel Faults (Overcurrent, DC Detection) Register (address = 0x10) [default = 0x00]
      15. 9.6.15Global Faults 1 Register (address = 0x11) [default = 0x00]
      16. 9.6.16Global Faults 2 Register (address = 0x12) [default = 0x00]
      17. 9.6.17Warnings Register (address = 0x13) [default = 0x20]
      18. 9.6.18Pin Control Register (address = 0x14) [default = 0xFF]
      19. 9.6.19AC Load Diagnostic Control 1 Register (address = 0x15) [default = 0x00]
      20. 9.6.20AC Load Diagnostic Control 2 Register (address = 0x16) [default = 0x00]
      21. 9.6.21AC Load Diagnostic Impedance Report Ch1 through CH4 Registers (address = 0x17-0x1A) [default = 0x00]
      22. 9.6.22AC Load Diagnostic Phase Report High Register (address = 0x1B) [default = 0x00]
      23. 9.6.23AC Load Diagnostic Phase Report Low Register (address = 0x1C) [default = 0x00]
      24. 9.6.24AC Load Diagnostic STI Report High Register (address = 0x1D) [default = 0x00]
      25. 9.6.25AC Load Diagnostic STI Report Low Register (address = 0x1C) [default = 0x00]
      26. 9.6.26Miscellaneous Control 3 Register (address = 0x21) [default = 0x00]
      27. 9.6.27Clip Control Register (address = 0x22) [default = 0x01]
      28. 9.6.28Clip Window Register (address = 0x23) [default = 0x14]
      29. 9.6.29Clip Warning Register (address = 0x24) [default = 0x00]
      30. 9.6.30ILIMIT Status Register (address = 0x25) [default = 0x00]
      31. 9.6.31Miscellaneous Control 4 Register (address = 0x26) [default = 0x40]
  10. 10Application and Implementation
    1. 10.1Application Information
      1. 10.1.1AM-Radio Band Avoidance
      2. 10.1.2Parallel BTL Operation (PBTL)
      3. 10.1.3Demodulation Filter Design
      4. 10.1.4Line Driver Applications
    2. 10.2Typical Applications
      1. 10.2.1BTL Application
        1. 10.2.1.1Design Requirements
        2. 10.2.1.2Power Supplies
        3. 10.2.1.3Communication
        4. 10.2.1.4Detailed Design Procedure
          1. 10.2.1.4.1Hardware Design
          2. 10.2.1.4.2Digital Input and the Serial Audio Port
          3. 10.2.1.4.3Bootstrap Capacitors
          4. 10.2.1.4.4Output Reconstruction Filter
        5. 10.2.1.5Application Curves
      2. 10.2.2PBTL Application
        1. 10.2.2.1Design Requirements
          1. 10.2.2.1.1Detailed Design Procedure
        2. 10.2.2.2Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1Layout Guidelines
      1. 12.1.1Electrical Connection of Thermal pad and Heat Sink
      2. 12.1.2EMI Considerations
      3. 12.1.3General Guidelines
    2. 12.2Layout Example
    3. 12.3Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1Documentation Support
      1. 13.1.1Related Documentation
    2. 13.2Receiving Notification of Documentation Updates
    3. 13.3Community Resources
    4. 13.4Trademarks
    5. 13.5Electrostatic Discharge Caution
    6. 13.6Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • DKQ|56
Orderable Information

Device and Documentation Support

Documentation Support

Related Documentation

For related documentation see the following:

PurePath™ Console 3 User Manual (SLOU408)

TAS6424-Q1 EVM User's Guide (SLOU453)

Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    E2E Audio Amplifier Forum TI's Engineer-to-Engineer (E2E) Community for Audio Amplifiers. Created to foster collaboration among engineers. Ask questions and receive answers in real-time.

Trademarks

PowerPAD, PurePath, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.