Home Interface I2C & I3C ICs I2C & I3C level shifters, buffers & hubs

TCA9511A

ACTIVE

2-bit bidirectional 2.3- to 5.5-V hot swappable 400-kHz I2C/SMBus buffer

Product details

Features Buffer, Enable pin, Hot swap Protocols I2C Frequency (max) (MHz) 0.4 VCCA (min) (V) 2.3 VCCA (max) (V) 5.5 VCCB (min) (V) 2.3 VCCB (max) (V) 5.5 Supply restrictions VCC Single Supply Rating Catalog Operating temperature range (°C) -40 to 125
Features Buffer, Enable pin, Hot swap Protocols I2C Frequency (max) (MHz) 0.4 VCCA (min) (V) 2.3 VCCA (max) (V) 5.5 VCCB (min) (V) 2.3 VCCB (max) (V) 5.5 Supply restrictions VCC Single Supply Rating Catalog Operating temperature range (°C) -40 to 125
VSSOP (DGK) 8 14.7 mm² 3 x 4.9
  • Supports bidirectional data transfer of I2C bus signals
  • Operating power-supply voltage range of 2.3 V to 5.5 V
  • TA ambient air temperature range of -40 °C to 125 °C
  • 1-V Precharge on all SDA and SCL lines prevents corruption during live insertion
  • Accommodates standard mode and fast mode I2C devices
  • Supports clock stretching, arbitration and synchronization
  • Powered-off high-impedance I2C pins
  • Supports bidirectional data transfer of I2C bus signals
  • Operating power-supply voltage range of 2.3 V to 5.5 V
  • TA ambient air temperature range of -40 °C to 125 °C
  • 1-V Precharge on all SDA and SCL lines prevents corruption during live insertion
  • Accommodates standard mode and fast mode I2C devices
  • Supports clock stretching, arbitration and synchronization
  • Powered-off high-impedance I2C pins

The TCA9511A is a hot-swappable I2C bus buffer that supports I/O card insertion into a live backplane without corruption of the data and clock lines. Control circuitry prevents the backplane-side I2C lines (in) from being connected to the card-side I2C lines (out) until a stop command or bus idle condition occurs on the backplane without bus contention on the card. When the connection is made, this device provides bidirectional buffering, keeping the backplane and card capacitances isolated. During insertion, the SDA and SCL lines are pre-charged to 1 V to minimize the current required to charge the parasitic capacitance of the device.

When the I2C bus is idle, the TCA9511A can be put into shutdown mode by setting the EN pin low, reducing power consumption. When EN is pulled high, the TCA9511A resumes normal operation. It also includes an open drain READY output pin, which indicates that the backplane and card sides are connected together. When READY is high, the SDAIN and SCLIN are connected to SDAOUT and SCLOUT. When the two sides are disconnected, READY is low.

The TCA9511A is a hot-swappable I2C bus buffer that supports I/O card insertion into a live backplane without corruption of the data and clock lines. Control circuitry prevents the backplane-side I2C lines (in) from being connected to the card-side I2C lines (out) until a stop command or bus idle condition occurs on the backplane without bus contention on the card. When the connection is made, this device provides bidirectional buffering, keeping the backplane and card capacitances isolated. During insertion, the SDA and SCL lines are pre-charged to 1 V to minimize the current required to charge the parasitic capacitance of the device.

When the I2C bus is idle, the TCA9511A can be put into shutdown mode by setting the EN pin low, reducing power consumption. When EN is pulled high, the TCA9511A resumes normal operation. It also includes an open drain READY output pin, which indicates that the backplane and card sides are connected together. When READY is high, the SDAIN and SCLIN are connected to SDAOUT and SCLOUT. When the two sides are disconnected, READY is low.

Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Same functionality with different pin-out to the compared device
TCA4307 ACTIVE 2-bit bidirectional 2.3-V to 5.5-V, hot-swappable 400-kHz I2C/SMBus buffer with stuck- With stuck bus recovery

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 4
Type Title Date
* Data sheet TCA9511A Hot Swappable I2C Bus and SMBus Buffer datasheet (Rev. C) PDF | HTML 25 Sep 2020
Application note I2C Solutions for Hot Swap Applications (Rev. A) 31 Jan 2023
Certificate TCA9511AEVM EU Declaration of Conformity (DoC) 18 Aug 2020
EVM User's guide EVM User's Guide for TCA9511A 04 Sep 2019

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TCA9511AEVM — Hot-swappable two-wire bus buffer evaluation module

This EVM provides configurable loading conditions through adjustable pull up resistors and bus capacitance which allows designers to easily test the performance of this device in their system. The EVM can be populated with a socket to test over temperature as well.
User guide: PDF
Not available on TI.com
Simulation model

TCA9511A IBIS Model

SCPM046.ZIP (44 KB) - IBIS Model
Design tool

I2C-DESIGNER — I2C designer tool

Use the I2C Designer tool to quickly resolve conflicts in addressing, voltage level and frequency in I2C based designs. Enter master and slave inputs to automatically generate an I2C tree or easily build a custom solution. This tool will help designers save time and comply with the I2C standard (...)
Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Simulation tool

TINA-TI — SPICE-based analog simulation program

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
User guide: PDF
Package Pins Download
VSSOP (DGK) 8 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos