Fabricated using the revolutionary, complementary Silicon-Germanium (SiGe) BiCom-3X process, the THS7320 is a very low power, single-supply, 2.6-V to 5-V, three-channel integrated video buffer with a gain of 4 V/V. This device is ideal for battery-powered applications where size and power are critical parameters. The total quiescent current is only 3.5 mA at 3 V and the video portion can be reduced down to 0.15 µA while disabled.
The THS7320 video section incorporates three enhanced definition (ED) filter channels with third-order Butterworth characteristics. These filters are useful as digital-to-analog converter (DAC) reconstruction filters or as analog-to-digital converter (ADC) antialiasing filters. The THS7320 is also ideal for oversampled systems that produce standard definition (SD) signals including CVBS, S-Video, 480i/576iY’P’BP’R, Y’U’V’, and R’G’B’.
The THS7320 is designed for dc-coupled inputs. To mitigate any DAC/encoder termination interaction, the input impedance is a very high 2.4 MΩ. The internal level shift adds 150-mV offset at the output to eliminate saturation or clipping concerns. The rail-to-rail output supports either dc- or ac-coupling.
The THS7320 is available in an ultra small, 9-ball wafer chip-scale package (WCSP) package that requires an ultra small, 0.92-mm2 (typ) printed circuit board (PCB) area.
|Diff gain (%)|
|Output current (Typ) (mA)|
|Vs (Min) (V)|
|Vs (Max) (V)|
|Diff phase (deg)|
|Number of channels (#)|
|Operating temperature range (C)|
|Package size: mm2:W x L (PKG)|
|-40 to 85||-40 to 85||-40 to 85||-40 to 85|
|SOIC | 8||SOIC | 8||SOIC | 8||uCSP | 9|
|8SOIC: 29 mm2: 6 x 4.9 (SOIC | 8)||8SOIC: 29 mm2: 6 x 4.9 (SOIC | 8)||8SOIC: 29 mm2: 6 x 4.9 (SOIC | 8)||9uCSP: 2 mm2: 1.5 x 1.5 (uCSP | 9)|
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