SLAS520E February   2007  – December 2014 TLV320AIC3101

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Diagram
  5. 5 Revision History
  6. 6 Description (continued)
  7. 7 Device Comparison Table
  8. 8 Pin Configuration and Functions
  9. 9 Specifications
    1. 9.1 Absolute Maximum Ratings
    2. 9.2 ESD Ratings
    3. 9.3 Recommended Operating Conditions
    4. 9.4 Thermal Information
    5. 9.5 Electrical Characteristics
    6. 9.6 Timing Requirements: Audio Data Serial Interface
    7. 9.7 Typical Characteristics
  10. 10Parameter Measurement Information
  11. 11Detailed Description
    1. 11.1 Overview
    2. 11.2 Functional Block Diagram
    3. 11.3 Feature Description
      1. 11.3.1  Hardware Reset
      2. 11.3.2  Digital Audio Data Serial Interface
        1. 11.3.2.1 Right-Justified Mode
        2. 11.3.2.2 Left-Justified Mode
        3. 11.3.2.3 I2S Mode
        4. 11.3.2.4 DSP Mode
        5. 11.3.2.5 TDM Data Transfer
      3. 11.3.3  Audio Data Converters
        1. 11.3.3.1 Audio Clock Generation
        2. 11.3.3.2 Stereo Audio ADC
          1. 11.3.3.2.1 Stereo Audio ADC High-Pass Filter
          2. 11.3.3.2.2 Automatic Gain Control (AGC)
            1. 11.3.3.2.2.1 Target Level
            2. 11.3.3.2.2.2 Attack Time
            3. 11.3.3.2.2.3 Decay Time
            4. 11.3.3.2.2.4 Noise Gate Threshold
            5. 11.3.3.2.2.5 Maximum PGA Gain Applicable
        3. 11.3.3.3 Stereo Audio DAC
          1. 11.3.3.3.1 Digital Audio Processing for Playback
          2. 11.3.3.3.2 Digital Interpolation Filter
          3. 11.3.3.3.3 Audio DAC Digital Volume Control
          4. 11.3.3.3.4 Increasing DAC Dynamic Range
          5. 11.3.3.3.5 Analog Output Common-Mode Adjustment
          6. 11.3.3.3.6 Audio DAC Power Control
      4. 11.3.4  Audio Analog Inputs
      5. 11.3.5  Analog Fully Differential Line Output Drivers
      6. 11.3.6  Analog High-Power Output Drivers
      7. 11.3.7  Input Impedance and VCM Control
      8. 11.3.8  MICBIAS Generation
      9. 11.3.9  Short-Circuit Output Protection
      10. 11.3.10 Jack/Headset Detection
    4. 11.4 Device Functional Modes
      1. 11.4.1 Bypass Path Mode
        1. 11.4.1.1 Analog Input Bypass Path Functionality
        2. 11.4.1.2 ADC PGA Signal Bypass Path Functionality
        3. 11.4.1.3 Passive Analog Bypass During Power Down
      2. 11.4.2 Digital Audio Processing for Record Path
    5. 11.5 Programming
      1. 11.5.1 I2C Control Interface
      2. 11.5.2 I2C Bus Debug in a Glitched System
    6. 11.6 Register Maps
    7. 11.7 Output Stage Volume Controls
  12. 12Application and Implementation
    1. 12.1 Application Information
    2. 12.2 Typical Application
      1. 12.2.1 AC-Coupled Headphone Output With Separate Line Outputs and External Speaker Amplifier
        1. 12.2.1.1 Design Requirements
        2. 12.2.1.2 Detailed Design Procedure
        3. 12.2.1.3 Application Curves
      2. 12.2.2 Connections With Headphone and External Speaker Driver in Cell Phone Application
        1. 12.2.2.1 Design Requirements
        2. 12.2.2.2 Detailed Design Procedure
        3. 12.2.2.3 Application Curves
  13. 13Power Supply Recommendations
  14. 14Layout
    1. 14.1 Layout Guidelines
    2. 14.2 Layout Example
  15. 15Device and Documentation Support
    1. 15.1 Trademarks
    2. 15.2 Electrostatic Discharge Caution
    3. 15.3 Glossary
  16. 16Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Specifications

9.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Input voltage AVDD to AVSS, DRVDD to DRVSS –0.3 3.9 V
AVDD to DRVSS –0.3 3.9 V
IOVDD to DVSS –0.3 3.9 V
DVDD to DVSS –0.3 2.5 V
AVDD to DRVDD –0.1 0.1 V
Digital input voltage to DVSS –0.3 IOVDD + 0.3 V
Analog input voltage to AVSS –0.3 AVDD + 0.3 V
Operating temperature –40 85 °C
Junction temperature, TJ 105 °C
Storage temperature, Tstg –65 105 °C
Power dissipation 0.5 W
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) ESD complicance tested to EIA/JESD22-A114-B and passed.

9.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

9.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
AVDD, DRVDD1/2(1) Analog supply voltage 2.7 3.3 3.6 V
DVDD(1) Digital core supply voltage 1.525 1.8 1.95 V
IOVDD(1) Digital I/O supply voltage 1.1 1.8 3.6 V
VI Analog full-scale 0-dB input voltage (DRVDD1 = 3.3 V) 0.707 VRMS
Stereo line output load resistance 10 kΩ
Stereo headphone output load resistance 16 Ω
Digital output load capacitance 10 pF
TA Operating free-air temperature –40 85 °C
(1) Analog voltage values are with respect to AVSS1, AVSS2, DRVSS; digital voltage values are with respect to DVSS.

9.4 Thermal Information

THERMAL METRIC(1) RHB UNIT
32 PINS
RθJA Junction-to-ambient thermal resistance 32.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 23.0
RθJB Junction-to-board thermal resistance 6.0
ψJT Junction-to-top characterization parameter 0.3
ψJB Junction-to-board characterization parameter 6.0
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

9.5 Electrical Characteristics

At 25°C, AVDD_DAC = DRVDD = IOVDD = 3.3 V, DVDD = 1.8 V, fS = 48 kHz, 16-bit audio data (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
AUDIO ADC
Input signal level Single-ended 0.707 VRMS
SNR Signal-to-noise ratio (1)(2) A-weighted, fS = 48 ksps, 0-dB PGA gain, inputs ac-shorted to ground 80 92 dB
Dynamic range (1)(2) fS = 48 ksps; 0-dB PGA gain; 1-kHz, –60-dB full-scale input signal 93 dB
THD Total harmonic distortion fS = 48 ksps; 0-dB PGA gain; 1-kHz, –2-dB full-scale input signal –89 –75 dB
PSRR Power-supply rejection ratio 217-Hz signal applied to DRVDD 55 dB
1-kHz signal applied to DRVDD 44
Input channel separation 1-kHz, –2-dB full-scale signal, MIC1L to MIC1R –71 dB
Gain error fS = 48 ksps; 0-dB PGA gain; 1-kHz, –2-dB full-scale input signal 0.82 dB
ADC programmable-gain amplifier maximum gain 1-kHz input tone 59.5 dB
ADC programmable-gain amplifier step size 0.5 dB
Input resistance MIC1L/MIC1R inputs routed to single ADC
input mix attenuation = 0 dB		 20 kΩ
MIC1L/MIC1R inputs routed to single ADC
input mix attenuation = 12 dB		 80
MIC2L/MIC2R inputs routed to single ADC
input mix attenuation = 0 dB		 20
MIC2L/MIC2R inputs routed to single ADC
input mix attenuation = 12 dB		 80
MIC3L/MIC3R inputs routed to single ADC
input mix attenuation = 0 dB		 20
MIC3L/MIC3R inputs routed to single ADC
input mix attenuation = 12 dB		 80
Input resistance 80 kΩ
Input capacitance MIC1/LINE1 inputs 10 pF
Input level control minimum attenuation setting 0 dB
Input level control maximum attenuation setting 12 dB
Input level control attenuation step size 1.5 dB
ANALOG PASSTHROUGH MODE
RDS(on) Input-to-output switch resistance MIC1/LIN1 to LINEOUT 330 Ω
MIC2/LIN2 to LINEOUT 330
INPUT SIGNAL LEVEL, DIFFERENTIAL
SNR Signal-to-noise ratio A-weighted, fS = 48 ksps, 0 dB PGA gain, inputs ac-shorted to ground 92 dB
THD Total harmonic distortion fS = 48 kHz; 0-dB PGA gain, 1-kHz, –2-dB full-scale input signal –94 dB
ADC DIGITAL DECIMATION FILTER, fS = 48 kHz
Filter gain From 0 to 0.39 fS ±0.1 dB
At 0.4125 fS –0.25
At 0.45 fS –3
At 0.5 fS –17.5
From 0.55 fS to 64 fS –75
Filter group delay 17/fS s
MICROPHONE BIAS
Bias voltage Programmable setting = 2 V 2 V
Programmable setting = 2.5 V 2.3 2.455 2.7
Programmable setting = DRVDD DRVDD – 0.24
Current sourcing Programmable setting = 2.5 V 4 mA
AUDIO DAC – DIFFERENTIAL LINE OUTPUT, RLOAD = 10 kΩ
Full-scale output voltage 0-dB input full-scale signal, output common-mode setting = 1.35 V, output volume control = 0 dB 1.414 VRMS
4 VPP
Signal-to-noise ratio (3) A-weighted, fS = 48 kHz, output volume control = 0 dB, no input signal, referenced to full-scale input level 90 102 dB
Dynamic range A-weighted, fS = 48 kHz, –60-dB input full-scale signal, output volume control = 0 dB, output common-mode setting = 1.35 V 97 dB
Total harmonic distortion fS = 48 kHz; 0-dB, 1-kHz input full-scale signal; output volume control = 0 dB; output common-mode setting = 1.35 V –95 –75 dB
PSRR Power-supply rejection ratio 217-Hz signal applied to DRVDD, AVDD_DAC 78 dB
1-kHz signal applied to DRVDD, AVDD_DAC 80
DAC channel separation 0-dB full-scale input signal between left and right lineout 86 dB
DAC interchannel gain mismatch 1-kHz input, 0-dB gain 0.1 dB
DAC gain error 0-dB, 1-kHz input full-scale signal; output volume control = 0 dB; output common-mode setting = 1.35 V; fS = 48 kHz –0.2 dB
AUDIO DAC – SINGLE ENDED LINE OUTPUT, RLOAD = 10 kΩ
Full-scale output voltage 0-dB input full-scale signal, output common-mode setting = 1.35 V, output volume control = 0 dB 0.707 VRMS
SNR Signal-to-noise ratio A-weighted, fS = 48 kHz, output volume control = 0 dB, no input signal, output common-mode setting = 1.35 V 97 dB
THD Total harmonic distortion fS = 48 kHz; 0-dB, 1-kHz input full-scale signal; output volume control = 0 dB; output common-mode setting = 1.35 V –84 dB
DAC gain error 0-dB, 1-kHz input full-scale signal; output volume control = 0 dB; output common-mode setting = 1.35 V; fS = 48 kHz 0.55 dB
AUDIO DAC – SINGLE-ENDED HEADPHONE OUTPUT, RLOAD = 16 Ω
Full-scale output voltage 0-dB input full-scale signal, output common-mode setting = 1.35 V, output volume control = 0 dB 0.707 VRMS
SNR Signal-to-noise ratio A-weighted, fS = 48 kHz, output volume control = 0 dB, no input signal, referenced to full-scale input level 96 dB
A-weighted, fS = 48 kHz, output volume control = 0 dB, no input signal, referenced to full-scale input level, 50% DAC current-boost mode 97
Dynamic range A-weighted, fS = 48 kHz, –60-dB input full-scale signal, output volume control = 0 dB, output common-mode setting = 1.35 V 91 dB
THD Total harmonic distortion fS = 48 kHz, 0-dB input full-scale signal, output volume control = 0 dB, output common-mode setting = 1.35 V –71 –65 dB
PSRR Power-supply rejection ratio 217-Hz signal applied to DRVDD, AVDD_DAC 43 dB
1-kHz signal applied to DRVDD, AVDD_DAC 41
DAC channel separation Right headphone out 89 dB
DAC gain error 0-dB, 1-kHz input full-scale signal; output volume control = 0 dB; output common-mode setting = 1.35 V; fS = 48 kHz –0.85 dB
AUDIO DAC – DIFFERENTIAL SPEAKER OUTPUT, RLOAD = 8 Ω
Full-scale output voltage 0-dB input full-scale signal, output common-mode setting = 1.35 V, output volume control = 0 dB 1.4142 VRMS
SNR Signal-to-noise ratio A-weighted, fS = 48 kHz, output volume control = 0 dB, no input signal, output common-mode setting = 1.35 V 86 dB
THD Total harmonic distortion fS = 48 kHz, 0-dB input full-scale signal, output volume control = 0 dB, output common-mode setting = 1.35 V –70 dB
DAC gain error fS = 48 kHz, 0-dB input full-scale signal, output volume control = 0 dB, output common-mode setting = 1.35 V –1 dB
DAC DIGITAL INTERPOLATION – FILTER fS = 48 kHz
Pass band 0 0.45 fS Hz
Pass-band ripple ±0.06 dB
Transition band 0.45 fS 0.55 fS Hz
Stop band 0.55 fS 7.5 fS Hz
Stop-band attenuation 65 dB
Group delay 21/fS s
STEREO HEADPHONE DRIVER – AC-COUPLED OUTPUT CONFIGURATION (3)
0-dB full-scale output voltage 0-dB gain to high-power outputs. Output common-mode voltage setting = 1.35 V 0.707 VRMS
Programmable output common-mode voltage (applicable to line outputs also) First option 1.35 V
Second option 1.5
Third option 1.65
Fourth option 1.8
Maximum programmable output level control gain 9 dB
Programmable output level control gain step size 1 dB
PO Maximum output power RL = 32 Ω 15 mW
RL = 16 Ω 30
Signal-to-noise ratio(4) A-weighted 94 dB
Total harmonic distortion 1-kHz output, PO = 5 mW, RL = 32 Ω –77 dB%
0.014
1-kHz output, PO = 10 mW, RL = 32 Ω –76
0.016
1-kHz output, PO = 10 mW, RL = 16 Ω –73
0.022
1-kHz output, PO = 20 mW, RL = 16 Ω –71
0.028
Channel separation 1-kHz, 0-dB input 90 dB
Power supply rejection ratio 217 Hz, 100 mVpp on AVDD, DRVDD1/2 48 dB
Mute attenuation 1-kHz output 107 dB
DIGITAL I/O
VIL Input low level –0.3 0.3 IOVDD V
VIH Input high level (5) IOVDD > 1.6 V 0.7 IOVDD V
IOVDD ≤ 1.6 V 1.1
VOL Output low level 0.1 IOVDD V
VOH Output high level 0.8 IOVDD V
CURRENT CONSUMPTION – DRVDD = AVDD_DAC = IOVDD = 3.3 V, DVDD = 1.8 V
IIN IDRVDD + IAVDD_DAC RESET held low 0.1 μA
IDVDD 0.2
IDRVDD + IAVDD_DAC Mono ADC record, fS = 8 ksps, I2S slave, AGC off, no signal 2.15 mA
IDVDD 0.48
IDRVDD + IAVDD_DAC Stereo ADC record, fS = 8 ksps, I2S slave, AGC off, no signal 4.1
IDVDD 0.62
IDRVDD + IAVDD_DAC Stereo ADC record, fS = 48 ksps, I2S slave, AGC off, no signal 4.31(6)
IDVDD 2.45(6)
IDRVDD + IAVDD_DAC Stereo DAC playback to lineout, analog mixer bypassed, fS = 48 ksps, I2S slave 3.5
IDVDD 2.3
IDRVDD + IAVDD_DAC Stereo DAC playback to lineout, fS = 48 ksps, I2S slave, no signal 4.9
IDVDD 2.3
IDRVDD + IAVDD_DAC Stereo DAC playback to stereo single-ended headphone, fS = 48 ksps, I2S slave, no signal 6.7
IDVDD 2.3
IDRVDD + IAVDD_DAC Stereo linein to stereo lineout, no signal 3.11
IDVDD 0
IDRVDD + IAVDD_DAC Extra power when PLL enabled 1.4
IDVDD 0.9
IDRVDD + IAVDD_DAC All blocks powered down. Headset detection enabled, headset not inserted 28 μA
IDVDD 2
(1) Ratio of output level with 1-kHz full-scale sine-wave input, to the output level with the inputs short-circuited, measured A-weighted over a 20-Hz to 20-kHz bandwidth using an audio analyzer.
(2) All performance measurements done with 20-kHz low-pass filter and, where noted, A-weighted filter. Failure to use such a filter may result in higher THD+N and lower SNR and dynamic range readings than shown in the Electrical Characteristics. The low-pass filter removes out-of-band noise, which, although not audible, may affect dynamic specification values.
(3) Unless otherwise noted, all measurements use output common-mode voltage setting of 1.35 V, 0-dB output level control gain, 16-Ω single-ended load.
(4) Ratio of output level with a 1-kHz full-scale input, to the output level playing an all-zero signal, measured A-weighted over a 20-Hz to 20-kHz bandwidth.
(5) When IOVDD < 1.6 V, minimum VIH is 1.1 V.
(6) Additional power is consumed when the PLL is powered.

9.6 Timing Requirements: Audio Data Serial Interface(1)

PARAMETER IOVDD = 1.1 V IOVDD = 3.3 V UNIT
MIN MAX MIN MAX
I2S/LJF/RJF Timing in Master Mode
td(WS) ADWS/WCLK delay time 50 15 ns
td(DO-WS) ADWS/WCLK to DOUT delay time 50 20 ns
td(DO-BCLK) BCLK to DOUT delay time 50 15 ns
ts(DI) DIN setup time 10 6 ns
th(DI) DIN hold time 10 6 ns
tr Rise time 30 10 ns
tf Fall time 30 10 ns
DSP Timing in Master Mode
td(WS) ADWS/WCLK delay time 50 15 ns
td(DO-BCLK) BCLK to DOUT delay time 50 15 ns
ts(DI) DIN setup time 10 6 ns
th(DI) DIN hold time 10 6 ns
tr Rise time 30 10 ns
tf Fall time 30 10 ns
I2S/LJF/RJF Timing in Slave Mode
tH(BCLK) BCLK high period 70 35 ns
tL(BCLK) BCLK low period 70 35 ns
ts(WS) ADWS/WCLK setup time 10 6 ns
th(WS) ADWS/WCLK hold time 10 6 ns
td(DO-WS) ADWS/WCLK to DOUT delay time (for LJF Mode only) 50 35 ns
td(DO-BCLK) BCLK to DOUT delay time 50 20 ns
ts(DI) DIN setup time 10 6 ns
th(DI) DIN hold time 10 6 ns
tr Rise time 8 4 ns
tf Fall time 8 4 ns
DSP Timing in Slave Mode
tH(BCLK) BCLK high period 70 35 ns
tL(BCLK) BCLK low period 70 35 ns
ts(WS) ADWS/WCLK setup time 10 8 ns
th(WS) ADWS/WCLK hold time 10 8 ns
td(DO-BCLK) BCLK to DOUT delay time 50 20 ns
ts(DI) DIN setup time 10 6 ns
th(DI) DIN hold time 10 6 ns
tr Rise time 8 4 ns
tf Fall time 8 4 ns
(1) All timing specifications are measured at characterization but not tested at final test.
t0145-01_las510.gif
All specifications at 25°C, DVDD = 1.8 V.
Figure 1. I2S/LJF/RJF Timing in Master Mode
t0146-01_las510.gifFigure 2. DSP Timing in Master Mode
t0145-02_las510.gifI2S/LJF/RJF Timing in Slave Mode
t0146-02_las510.gifDSP Timing in Slave Mode

9.7 Typical Characteristics

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Figure 3. THD vs Headphone Power, AC-Coupled
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Figure 4. THD vs Headphone Power, Capless
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Figure 5. DAC to Line Output FFT Plot
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Figure 7. THD vs Speaker Power, 8 Ω Load
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Figure 9. ADC Gain Error vs PGA Gain Setting
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Figure 11. MICBIAS Output Voltage vs Ambient Temperature
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Figure 6. Line Input to ADC FFT Plot
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Figure 8. ADC SNR vs PGA Gain Setting, –65-dBFS Input
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Figure 10. MICBIAS Output Voltage vs AVDD