Product details

Local sensor accuracy (max) 1 Type Local Operating temperature range (°C) to Supply voltage (min) (V) 2.2 Interface type I2C, SMBus Supply voltage (max) (V) 5.5V Temp resolution (max) (Bits) 14 Rating Catalog
Local sensor accuracy (max) 1 Type Local Operating temperature range (°C) to Supply voltage (min) (V) 2.2 Interface type I2C, SMBus Supply voltage (max) (V) 5.5V Temp resolution (max) (Bits) 14 Rating Catalog
DSBGA (YZF) 8 3.0625 mm² 1.75 x 1.75
  • Integrated MEMs Thermopile for Noncontact Temperature Sensing
  • Local Temperature Sensor for Cold Junction Reference
    • ±1°C (max) from 0°C to 60°C
    • ±1.5°C (max) from –40°C to +125°C
  • Two-Wire Serial Interface Options:
    • I2C and SMBus Compatible
      • TMP006 at 3.3 V
      • TMP006B at 1.8 V
    • Eight Programmable Addresses
  • Low Power
    • Supply: 2.2 V to 5.5 V
    • Active Current: 240 µA (typ)
    • 1-µA shutdown (max)
  • Compact Package
    • 1.6-mm × 1.6-mm × 0.625-mm DSBGA
  • Integrated MEMs Thermopile for Noncontact Temperature Sensing
  • Local Temperature Sensor for Cold Junction Reference
    • ±1°C (max) from 0°C to 60°C
    • ±1.5°C (max) from –40°C to +125°C
  • Two-Wire Serial Interface Options:
    • I2C and SMBus Compatible
      • TMP006 at 3.3 V
      • TMP006B at 1.8 V
    • Eight Programmable Addresses
  • Low Power
    • Supply: 2.2 V to 5.5 V
    • Active Current: 240 µA (typ)
    • 1-µA shutdown (max)
  • Compact Package
    • 1.6-mm × 1.6-mm × 0.625-mm DSBGA

The TMP006 and TMP006B are fully integrated MEMs thermopile sensors that measure the temperature of an object without having to be in direct contact. The thermopile absorbs passive infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view.

The corresponding change in voltage across the thermopile is digitized and reported with the on-chip die thermal sensor measurement through an I2C- and SMBus-compatible interface. With this data, the target object temperature can be calculated by an external processor.

The TMP007 is an enhanced version of the TMP006 or TMP006B. The TMP007 combines all the features of the TMP006 and TMP006B with an additional math engine to perform all of the equations on chip, allowing the target object temperature to be read directly from the device. The TMP007 also provides built-in nonvolatile memory for storing calibration coefficients.

The Infrared thermopile sensor is specified to operate from –40°C to +125°C. It is possible to measure an object temperature beyond the device operating range as long as the device itself does not exceed the operating temperature range (–40°C to +125°C).

 

 

The TMP006 and TMP006B are fully integrated MEMs thermopile sensors that measure the temperature of an object without having to be in direct contact. The thermopile absorbs passive infrared energy from an object at wavelengths between 4 um to 16 um within the end-user defined field of view.

The corresponding change in voltage across the thermopile is digitized and reported with the on-chip die thermal sensor measurement through an I2C- and SMBus-compatible interface. With this data, the target object temperature can be calculated by an external processor.

The TMP007 is an enhanced version of the TMP006 or TMP006B. The TMP007 combines all the features of the TMP006 and TMP006B with an additional math engine to perform all of the equations on chip, allowing the target object temperature to be read directly from the device. The TMP007 also provides built-in nonvolatile memory for storing calibration coefficients.

The Infrared thermopile sensor is specified to operate from –40°C to +125°C. It is possible to measure an object temperature beyond the device operating range as long as the device itself does not exceed the operating temperature range (–40°C to +125°C).

 

 

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 2
Type Title Date
* Data sheet TMP006/B Infrared Thermopile Sensor in Chip-Scale Package datasheet (Rev. E) PDF | HTML 09 Apr 2015
Technical article Taking advantage of real-time operating systems with MSP432 MCUs PDF | HTML 27 May 2015

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Daughter card

BOOSTXL-EDUMKII — Educational BoosterPack MKII

The Educational BoosterPack MKII offers a high level of integration for developers to quickly prototype complete solutions. Various analog and digital inputs/outputs are at your disposal including an analog joystick, environmental and motion sensors, RGB LED, microphone, buzzer, color LCD display, (...)

User guide: PDF | HTML
Not available on TI.com
Plug-in

SIMPLELINK-SDK-SENSOR-ACTUATOR-PLUGIN Sensor and Actuator Plug-in for SimpleLink™ MCU SDKs

The Sensor and Actuator Plugin for SimpleLink™ MCU SDKs provides support for a variety of related components including optical and temperature and humidity sensors, allowing customers to easily add new features to their SimpleLink MCU-based design. API user guides are provided for each (...)

lock = Requires export approval (1 minute)
Supported products & hardware

Supported products & hardware

Products
Digital temperature sensors
TMP006 Infrared Thermopile Contactless Temperature Sensor in WCSP Package TMP007 Infrared Thermopile Contactless Temperature Sensor with Integrated Math Engine in WCSP Package TMP116 0.2C digital temperature sensor, 64-bit non-volatile memory
Ultrasonic sensor AFEs
PGA460 Ultrasonic signal processor and transducer driver
Wi-Fi products
CC3220MODA SimpleLink™ 32-bit Arm Cortex-M4 Wi-Fi CERTIFIED™ wireless module with antenna CC3220R SimpleLink™ 32-bit Arm Cortex-M4 Wi-Fi® wireless MCU with 6 TLS/SSL and 256kB RAM CC3220S SimpleLink™ 32-bit Arm Cortex-M4 Wi-Fi® wireless MCU with secure boot and 256kB RAM CC3220SF SimpleLink™ 32-bit Arm Cortex-M4 Wi-Fi® wireless MCU with 1MB Flash and 256kB RAM
Linear Hall-effect sensors
DRV5055 Ratiometric linear hall effect sensor with analog output
Humidity sensors
HDC2010 2% RH ultra-small, low-power digital relative humidity sensor HDC2080 2% RH ultra-low-power digital relative humidity sensor, interrupt/DRDY
Precision ADCs
ADS7142 12-bit 140-kSPS 2-ch nanopower SAR ADC with 1.8-V operation in 1.5-mm x 2-mm QFN package ADS7142-Q1 Automotive 2-channel 12-bit 140-kSPS I2C-compatible ADC with programmable threshold and host wake-up
Low-power 2.4-GHz products
CC2640R2F SimpleLink™ 32-bit Arm® Cortex®-M3 Bluetooth® 5.1 Low Energy wireless MCU with 128-kB flash
Light sensors
OPT3001 Digital ambient light sensor (ALS) with high-precision human-eye response
Hardware development
BOOSTXL-ADS7142-Q1 ADS7142-Q1 2-channel 12-bit 140-kSPS I2C-compatible ADC BoosterPack™ plug-in module BOOSTXL-BASSENSORS Sensors BoosterPack plug-in module for building automation BOOSTXL-PGA460 PGA460-Q1 ultrasonic sensor signal conditioning evaluation module with transducers BOOSTXL-ULN2003 Dual Stepper Motor Driver BoosterPack featuring ULN2003 and CSD17571Q2 NexFET™ CC3220S-LAUNCHXL CC3220S LaunchPad™ development kit for Wi-Fi® SimpleLink™ wireless MCU CC3220SF-LAUNCHXL CC3220SF LaunchPad™ development kit for Wi-Fi® SimpleLink™ wireless MCU LAUNCHXL-CC1310 CC1310 LaunchPad™ development kit for sub-1-GHz SimpleLink™ wireless MCU LAUNCHXL-CC1352R1 CC1352R LaunchPad™ development kit for SimpleLink™ multi-band wireless MCU LAUNCHXL-CC2640R2 CC2640R2 LaunchPad™ development kit for SimpleLink™ Bluetooth® Low Energy wireless MCU LAUNCHXL-CC26X2R1 CC26x2R LaunchPad™ development kit for multi-standard SimpleLink™ wireless MCU MSP-EXP432E401Y MSP432E401Y LaunchPad™ development kit for Ethernet SimpleLink™ MCU
Browse Download options
Support software

SBOC407 TMP006EVM Software Source Code

Supported products & hardware

Supported products & hardware

Products
Digital temperature sensors
TMP006 Infrared Thermopile Contactless Temperature Sensor in WCSP Package
Support software

SBOC408 TMP006EVM User Software

Supported products & hardware

Supported products & hardware

Products
Digital temperature sensors
TMP006 Infrared Thermopile Contactless Temperature Sensor in WCSP Package
Support software

SENSORTAG-SW — SimpleLink™ SensorTag Software

The SensorTag includes an open hardware and software reference design for low cost and low power wireless IoT applications. The SensorTag is supplied with complete source code with everything you need to customize it for your application as well as source code examples for mobile apps.
Reference designs

TIDA-00554 — DLP Ultra-mobile NIR Spectrometer for Portable Chemical Analysis with Bluetooth Connectivity

The ultra-mobile near-infrared (NIR) spectrometer reference design utilizes Texas Instruments' DLP technology in conjunction with a single-element InGaAs detector to deliver high performance measurements in a portable form factor that is more affordable than architectures using an expensive InGaAs (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDC-CC3200MODLAUNCHXL — SimpleLink™ Wi-Fi® CC3200 Module LaunchPad

The CC3200MODLAUNCHXL is a low-cost evaluation platform which hosts the CC3200MOD. The SimpleLink™ CC3200MOD is a wireless microcontroller (MCU) module that integrates an ARM® Cortex™-M4 based MCU, allowing customers to develop an entire application using a single device. The module (...)
User guide: PDF
Schematic: PDF
Reference designs

TIDM-SMBUS — SMBus Design Using Low Power Microcontroller

This design utilizes existing Launchpad evaluation kits and BoosterPack plug-in modules to demonstrate the implementation of a SMBus-based system using Texas Instrument’s MSP430 SMBus Library.
Design guide: PDF
Schematic: PDF
Reference designs

CC2541-SENSORTAG-IBEACON-RD — SensorTag with iBeacon™ technology

The SimpleLink Bluetooth® Smart SensorTag removes the barriers to entry for smartphone app developers who want to take advantage of the growing number of Bluetooth® Smart-enabled smartphones and tablets. iBeacon Technology is a very low cost method for providing mobile phones with (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDM-LPBP-SENSORHUB — Comprehensive Sensor Hub Solution with Seven On-Board Sensors

This Sensor Hub design uses a Tiva platform for evaluating the use of ARM® Cortex™-M4-based TM4C devices in sensor fusion applications, demonstrating the mathematical and algorithm computation features of the M4 architecture. This design features seven on-board sensor functions including (...)
Schematic: PDF
Package Pins Download
DSBGA (YZF) 8 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos