SBOS518E May   2011  – April 2015 TMP006

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Spectral Responsivity
      2. 8.3.2 Field of View and Angular Response
      3. 8.3.3 Thermopile Principles and Operation
      4. 8.3.4 Object Temperature Calculation
      5. 8.3.5 Calibration
      6. 8.3.6 Sensor Voltage Format
      7. 8.3.7 Temperature Format
      8. 8.3.8 Serial Interface
        1. 8.3.8.1 Serial Bus Address
        2. 8.3.8.2 Read and Write Operations
        3. 8.3.8.3 Two-Wire Timing Diagrams
    4. 8.4 Device Functional Modes
    5. 8.5 Register Maps
      1. 8.5.1 Sensor Voltage Result (VSENSOR) Register (address = 00h) [reset = 0000000000000000]
      2. 8.5.2 Temperature (TDIE) Register (address = 01h) [reset = 0000000000000000]
      3. 8.5.3 Configuration Register (address = 02h) [reset = 0111010000000000]
      4. 8.5.4 Manufacturer and Device ID Registers
        1. 8.5.4.1 Manufacturer ID Register (address = FEh) [reset = 0101010001001001]
        2. 8.5.4.2 Device ID Register (address = FFh) [reset = 0000000001100111]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Wide-Range Calibration Example: TOBJ = 0°C to 60°C, Common vs Unit Calibration
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Wide-Range Calibration
          2. 9.2.1.2.2 Verifying the Calibration
        3. 9.2.1.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Use of NEP, NETD, and Responsivity in Estimating System Performance
  10. 10Power-Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Device Nomenclature

The device performance is characterized by the signal, responsivity, and the noise of the sensor. The sensor noise can be characterized in terms of the raw sensor voltage, or in terms of a reference system with known optical transfer function.

    ResponsivityA measure of the voltage generated by the thermopile as a function of the thermal radiation incident on the device. The responsivity is measured in V/W. Typically incident radiations are in µW and sensor output voltages in µV.
    Sensor NoiseThe noise voltage intrinsic to the sensor given in nV. This parameter is conversion-time dependent.
    Noise Equivalent Power (NEP)The smallest thermal power difference that the detector can reliably detect; measured in nW. The NEP is a function of the sensor noise and the responsivity.
    Noise Equivalent Temperature Difference (NETD)The smallest temperature difference the detector can reliably detect; measured in milliKelvins (mK). The NETD is a function of the sensor noise, responsivity and the system specific optical path.

    For comparison purposes, NETD is given for a reference system without a lens and with an ideal (nonabsorbing) F/1 lens.

12.2 Documentation Support

12.2.1 Related Documentation

TMP007 Calibration Guide, SBOU142.

TMP006 Layout and Assembly Guidelines, SBOU108.

12.3 Related Links

Table 12 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 12. Related Links

PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
TMP006 Click here Click here Click here Click here Click here
TMP006B Click here Click here Click here Click here Click here

12.4 Trademarks

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.