SBOS518E May   2011  – April 2015 TMP006

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Spectral Responsivity
      2. 8.3.2 Field of View and Angular Response
      3. 8.3.3 Thermopile Principles and Operation
      4. 8.3.4 Object Temperature Calculation
      5. 8.3.5 Calibration
      6. 8.3.6 Sensor Voltage Format
      7. 8.3.7 Temperature Format
      8. 8.3.8 Serial Interface
        1. 8.3.8.1 Serial Bus Address
        2. 8.3.8.2 Read and Write Operations
        3. 8.3.8.3 Two-Wire Timing Diagrams
    4. 8.4 Device Functional Modes
    5. 8.5 Register Maps
      1. 8.5.1 Sensor Voltage Result (VSENSOR) Register (address = 00h) [reset = 0000000000000000]
      2. 8.5.2 Temperature (TDIE) Register (address = 01h) [reset = 0000000000000000]
      3. 8.5.3 Configuration Register (address = 02h) [reset = 0111010000000000]
      4. 8.5.4 Manufacturer and Device ID Registers
        1. 8.5.4.1 Manufacturer ID Register (address = FEh) [reset = 0101010001001001]
        2. 8.5.4.2 Device ID Register (address = FFh) [reset = 0000000001100111]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Wide-Range Calibration Example: TOBJ = 0°C to 60°C, Common vs Unit Calibration
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Wide-Range Calibration
          2. 9.2.1.2.2 Verifying the Calibration
        3. 9.2.1.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Use of NEP, NETD, and Responsivity in Estimating System Performance
  10. 10Power-Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from D Revision (November 2014) to E Revision

  • Changed Feature, Applications, and Description sections Go
  • Changed thermopile sensor portion of simplified schematicGo
  • Changed operating range minimum value in Absolute Maximum Ratings from –55°C to –40°CGo
  • Changed Handling Ratings to ESD Ratings and moved storage temperature to Absolute Maximum RatingsGo
  • Changed Figure 3Go
  • Changed thermopile sensor portion of functional block diagramGo
  • Deleted text at the end of 2nd paragraph in Field of View and Angular Response section Go
  • Added Figure 8Go
  • Changed TREG to TDIE in Temperature Format section Go

Changes from C Revision (December 2012) to D Revision

  • Changed all instances of WCSP to DSBGA throughout data sheetGo
  • Changed document format to latest data sheet standardsGo
  • Added Device Comparison, Handling Rating, and Recommended Operating Conditions tables, and Feature Description, Device Functional Modes, Register Maps, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Changed text in first paragraph of Description section Go
  • Changed all instances of "local temperature" to "die temperature" throughout data sheet Go
  • Moved histogram from page 1 to Typical Characteristics sectionGo
  • Added Simplified Schematic title to front-page figure Go
  • Changed simplified schematicGo
  • Deleted Package Information table Go
  • Changed all TObject to TOBJ throughout data sheetGo
  • Changed x- and y-axis labels in Figure 1Go
  • Changed text related to object temperature measurement in first paragraph of Overview sectionGo
  • Changed Table 3Go
  • Changed all VOBJECT to VSENSOR throughout datasheetGo
  • Deleted Pointer Register sectionGo
  • Changed Sensor Voltage Register name to Sensor Voltage Result Register Go
  • Changed TAMBIENT to TDIE throughout data sheet Go

Changes from B Revision (February 2012) to C Revision

  • Added TMP006B device to data sheetGo
  • Changed Package Information table to include new TMP006B device with the TMP006, and show the different voltage for the two devicesGo

Changes from A Revision (July 2011) to B Revision

  • Changed Output Error, Calculate object temperature parameter test conditions in Electrical Characteristics tableGo
  • Changed description of device ID to 0067h in Manufacturer and Device ID Registers sectionGo
  • Changed FFh, Reset value bits D2, D1, and D0 values in Figure 18Go
  • Changed Figure 23Go
  • Changed Figure 24Go
  • Changed Figure 25Go

Changes from * Revision (May, 2011) to A Revision

  • Added specifications for ambient temperature sensor parameter over 0°C to +60°CGo
  • Revised Table 4Go