SBOS762B November   2016  – June 2017 TMP468

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Two-Wire Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Temperature Measurement Data
      2. 7.3.2 Series Resistance Cancellation
      3. 7.3.3 Differential Input Capacitance
      4. 7.3.4 Sensor Fault
      5. 7.3.5 THERM Functions
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode (SD)
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Bus Overview
        2. 7.5.1.2 Bus Definitions
        3. 7.5.1.3 Serial Bus Address
        4. 7.5.1.4 Read and Write Operations
          1. 7.5.1.4.1 Single Register Reads
          2. 7.5.1.4.2 Block Register Reads
        5. 7.5.1.5 Timeout Function
        6. 7.5.1.6 High-Speed Mode
      2. 7.5.2 TMP468 Register Reset
      3. 7.5.3 Lock Register
    6. 7.6 Register Maps
      1. 7.6.1 Register Information
        1. 7.6.1.1  Pointer Register
        2. 7.6.1.2  Local and Remote Temperature Value Registers
        3. 7.6.1.3  Software Reset Register
        4. 7.6.1.4  THERM Status Register
        5. 7.6.1.5  THERM2 Status Register
        6. 7.6.1.6  Remote Channel Open Status Register
        7. 7.6.1.7  Configuration Register
        8. 7.6.1.8  η-Factor Correction Register
        9. 7.6.1.9  Remote Temperature Offset Register
        10. 7.6.1.10 THERM Hysteresis Register
        11. 7.6.1.11 Local and Remote THERM and THERM2 Limit Registers
        12. 7.6.1.12 Block Read - Auto Increment Pointer
        13. 7.6.1.13 Lock Register
        14. 7.6.1.14 Manufacturer and Device Identification Plus Revision Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • 8-Channel Remote Diode Temperature Sensor Accuracy: ±0.75°C (Maximum)
  • Local and Remote Diode Accuracy: ±0.75°C (Maximum)
  • Local Temperature Sensor Accuracy for the DSBGA Package: ±0.35°C (Maximum)
  • Temperature Resolution: 0.0625°C
  • Supply and Logic Voltage Range: 1.7 V to 3.6 V
  • 67-µA Operating Current (1 SPS, All Channels Active)
  • 0.3-µA Shutdown Current
  • Remote Diode: Series Resistance Cancellation,
    η-Factor Correction, Offset Correction, and Diode Fault Detection
  • Register Lock Function Secures Key Registers
  • I2C or SMBus™ Compatible Two-Wire Interface With Pin-Programmable Address
  • 16-Bump DSBGA and 16-Pin VQFN Packages

2 Applications

  • MCU, GPU, ASIC, FPGA, DSP, and CPU Temperature Monitoring
  • Telecommunication Equipment
  • Servers and Personal Computers
  • Cloud Ethernet Switches
  • Secure Data Centers
  • Highly Integrated Medical Systems
  • Precision Instruments and Test Equipment
  • LED Lighting Thermal Control

3 Description

The TMP468 device is a multi-zone, high-accuracy, low-power temperature sensor using a two-wire, SMBus or I2C compatible interface. Up to eight remote diode-connected temperature zones can be monitored simultaneously in addition to the local temperature. Aggregating the temperature measurements across a system allows improved performance through tighter guard bands and can reduce board complexity. A typical use case is for monitoring the temperature across different processors, such as MCUs, GPUs, and FPGAs in complex systems such as servers and telecommunications equipment. Advanced features such as series resistance cancellation, programmable non-ideality factor, programmable offset, and programmable temperature limits are included to provide a robust thermal monitoring solution with improved accuracy and noise immunity.

Each of the eight remote channels (and the local channel) can be programmed independently with two thresholds that are triggered when the corresponding temperature is exceeded at the measured location. In addition, there is a programmable hysteresis setting to avoid constant toggling around the threshold.

The TMP468 device provides high accuracy (0.75°C) and high resolution (0.0625°C) measurement capabilities. The device supports low voltage rails (1.7 V to 3.6 V), common two-wire interfaces, and is available in a small, space efficient package (3 mm × 3 mm or 1.6 mm × 1.6 mm) for easy integration into computing systems. The remote junction supports a temperature range from –55°C to +150°C.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TMP468 DSBGA (16) 1.60 mm × 1.60 mm
VQFN (16) 3.00 mm × 3.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Typical Application Schematic

TMP468 tmp468_page1_diag_v2.gif
See the Design Requirements section for remote diode recommendations.