SLASE40D May 2015  – April 2016 TPA3251

PRODUCTION DATA. 

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Audio Characteristics (BTL)
    7. 7.7 Audio Characteristics (SE)
    8. 7.8 Audio Characteristics (PBTL)
    9. 7.9 Typical Characteristics, BTL Configuration
    10. 7.10Typical Characteristics, SE Configuration
    11. 7.11Typical Characteristics, PBTL Configuration
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1Overview
    2. 9.2Functional Block Diagrams
    3. 9.3Feature Description
      1. 9.3.1Error Reporting
    4. 9.4Device Protection System
      1. 9.4.1Overload and Short Circuit Current Protection
      2. 9.4.2DC Speaker Protection
      3. 9.4.3Pin-to-Pin Short Circuit Protection (PPSC)
      4. 9.4.4Overtemperature Protection OTW and OTE
      5. 9.4.5Undervoltage Protection (UVP) and Power-on Reset (POR)
      6. 9.4.6Fault Handling
      7. 9.4.7Device Reset
  10. 10Application and Implementation
    1. 10.1Application Information
    2. 10.2Typical Applications
      1. 10.2.1Stereo BTL Application
        1. 10.2.1.1Design Requirements
        2. 10.2.1.2Detailed Design Procedures
          1. 10.2.1.2.1Decoupling Capacitor Recommendations
          2. 10.2.1.2.2PVDD Capacitor Recommendation
          3. 10.2.1.2.3PCB Material Recommendation
          4. 10.2.1.2.4Oscillator
      2. 10.2.2Application Curves
      3. 10.2.3Typical Application, Single Ended (1N) SE
        1. 10.2.3.1Design Requirements
        2. 10.2.3.2Detailed Design Procedures
        3. 10.2.3.3Application Curves
      4. 10.2.4Typical Application, Differential (2N) PBTL
        1. 10.2.4.1Design Requirements
        2. 10.2.4.2Detailed Design Procedures
        3. 10.2.4.3Application Curves
  11. 11Power Supply Recommendations
    1. 11.1Power Supplies
      1. 11.1.1VDD Supply
    2. 11.2Powering Up
    3. 11.3Powering Down
  12. 12Layout
    1. 12.1Layout Guidelines
    2. 12.2Layout Examples
      1. 12.2.1BTL Application Printed Circuit Board Layout Example
      2. 12.2.2SE Application Printed Circuit Board Layout Example
      3. 12.2.3PBTL Application Printed Circuit Board Layout Example
  13. 13Device and Documentation Support
    1. 13.1Documentation Support
    2. 13.2Community Resources
    3. 13.3Trademarks
    4. 13.4Electrostatic Discharge Caution
    5. 13.5Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Orderable Information

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