Home Interface Diodes ESD protection diodes

TPD4E02B04-Q1

ACTIVE

Automotive Quad 0.25-pF, ±3.6-V, ±12-kV ESD protection diode for USB 3.0 & High

TPD4E02B04-Q1

ACTIVE

Product details

Package name USON Peak pulse power (8/20 μs) (max) (W) 17 Vrwm (V) 3.6 Bi-/uni-directional Bi-directional Number of channels 4 IO capacitance (typ) (pF) 0.25 Clamping voltage (V) 6.6 Breakdown voltage (min) (V) 5.5
Package name USON Peak pulse power (8/20 μs) (max) (W) 17 Vrwm (V) 3.6 Bi-/uni-directional Bi-directional Number of channels 4 IO capacitance (typ) (pF) 0.25 Clamping voltage (V) 6.6 Breakdown voltage (min) (V) 5.5
USON (DQA) 10 2.5 mm² 2.5 x 1
  • AEC-Q101 Qualified
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±12-kV Contact Discharge
    • ±15-kV Air Gap Discharge
  • ISO 10605 (330 pF, 330 Ω) ESD Protection
    • ±10 kV Contact Discharge
    • ±10-kV Air Gap Discharge
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 2 A (8/20 µs)
  • IO Capacitance:
    • 0.25 pF (Typical)
  • DC Breakdown Voltage: 5.5 V (Minimum)
  • Ultra Low Leakage Current: 10 nA (Maximum)
  • Low ESD Clamping Voltage: 8.8 V at 5-A TLP
  • Supports High Speed Interfaces up to 10 Gbps
  • Industrial Temperature Range: –40°C to +125°C
  • Easy Flow-Through Routing Package
  • AEC-Q101 Qualified
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±12-kV Contact Discharge
    • ±15-kV Air Gap Discharge
  • ISO 10605 (330 pF, 330 Ω) ESD Protection
    • ±10 kV Contact Discharge
    • ±10-kV Air Gap Discharge
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 2 A (8/20 µs)
  • IO Capacitance:
    • 0.25 pF (Typical)
  • DC Breakdown Voltage: 5.5 V (Minimum)
  • Ultra Low Leakage Current: 10 nA (Maximum)
  • Low ESD Clamping Voltage: 8.8 V at 5-A TLP
  • Supports High Speed Interfaces up to 10 Gbps
  • Industrial Temperature Range: –40°C to +125°C
  • Easy Flow-Through Routing Package

The TPD4E02B04-Q1 is an automotive-qualified bidirectional TVS ESD protection diode array for USB Type-C and HDMI 2.0 circuit protection. The TPD4E02B04-Q1 is rated to dissipate ESD strikes up to 10 kV per ISO 10605 (330 pF, 330 Ω) ESD standard. The TPD4E02B04 is also rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4).

This device features a 0.25-pF IO capacitance per channel making it ideal for protecting high-speed interfaces up to 10 Gbps such as USB 3.1 Gen2. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

The TPD4E02B04-Q1 is offered in the industry standard USON-10 (DQA) package. The package features flow-through routing and 0.5-mm pin pitch easing implementation and reducing design time.

This device is also available without automotive qualification: TPD4E02B04.

The TPD4E02B04-Q1 is an automotive-qualified bidirectional TVS ESD protection diode array for USB Type-C and HDMI 2.0 circuit protection. The TPD4E02B04-Q1 is rated to dissipate ESD strikes up to 10 kV per ISO 10605 (330 pF, 330 Ω) ESD standard. The TPD4E02B04 is also rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Level 4).

This device features a 0.25-pF IO capacitance per channel making it ideal for protecting high-speed interfaces up to 10 Gbps such as USB 3.1 Gen2. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

The TPD4E02B04-Q1 is offered in the industry standard USON-10 (DQA) package. The package features flow-through routing and 0.5-mm pin pitch easing implementation and reducing design time.

This device is also available without automotive qualification: TPD4E02B04.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 6
Type Title Date
* Data sheet TPD4E02B04-Q1 4-Channel ESD Protection Diode for USB Type-C and HDMI 2.0 datasheet (Rev. A) PDF | HTML 19 Sep 2017
Application note ESD and Surge Protection for USB Interfaces (Rev. B) PDF | HTML 11 Jan 2024
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 18 Aug 2022
Application note ISO 10605 Road Vehicles Test Methods for Elec. Disturbances from Electrostatic D (Rev. B) PDF | HTML 17 Aug 2022
Application brief ESD Protection for Automotive Infotainment (Rev. A) PDF | HTML 12 Nov 2021
Application brief Automotive SerDes ESD Protection (Rev. A) PDF | HTML 06 Oct 2021

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

ESDEVM — Generic ESD Evaluation Module

Texas Instrument's ESDEVM evaluation module allows the evaluation of most of TI's ESD portfolio. The board comes with all traditional ESD footprints in order to be able to test any number of devices. Devices that need to be tested can be soldered onto their respect footprint and then tested. For (...)
User guide: PDF | HTML
Not available on TI.com
Simulation model

TPD4E02B04 IBIS Model

SLVMBE9.ZIP (2 KB) - IBIS Model
Simulation model

TPD4E02B04 S-Parameter Model

SLVMBK1.ZIP (428 KB) - IBIS Model
Simulation model

TPD4E02B04-Q1 PSpice Transient Model

SLVMDL3.ZIP (209 KB) - PSpice Model
Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Simulation tool

TINA-TI — SPICE-based analog simulation program

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
User guide: PDF
Package Pins Download
USON (DQA) 10 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos