SGLS303F May   2005  – April 2016 TPS732-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Internal Current Limit
      2. 7.3.2 Shutdown
      3. 7.3.3 Dropout Voltage
      4. 7.3.4 Transient Response
      5. 7.3.5 Reverse Current
      6. 7.3.6 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitor Requirements
        2. 8.2.2.2 Output Noise
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
    4. 10.4 Package Mounting
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VIN –0.3 6 V
VEN –0.3 6 V
VOUT –0.3 5.5 V
Peak output current Internally limited
Output short-circuit duration Indefinite
Junction temperature, TJ –55 150 °C
Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±4000 V
Charged-device model (CDM), per AEC Q100-011 ±1000
Machine model (MM) ±200
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN Input voltage(1) 1.7 5.5 V
IOUT Output current 0 250 mA
TJ Operating junction temperature –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TPS732-Q1 UNIT
DBV (SOT-23) DRB (VSON)
5 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 180 47.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 64 83 °C/W
RθJB Junction-to-board thermal resistance 35 — °C/W
ψJT Junction-to-top characterization parameter — 2.1 °C/W
ψJB Junction-to-board characterization parameter — 17.8 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — 12.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Over operating temperature range (TJ = –40°C to 125°C), VIN = VOUT(nom) + 0.5 V(1), IOUT = 10 mA, VEN = 1.7 V, and COUT = 0.1 μF, unless otherwise noted. Typical values are at TJ = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VFB Internal reference (TPS73201-Q1) TJ = 25°C 1.198 1.2 1.21 V
VOUT Output voltage range (TPS73201-Q1)(2) VFB 5.5 – VDO V
Accuracy(1) Nominal TJ = 25°C –0.5% 0.5%
VIN, IOUT, and TJ (VOUT + 0.5 V) ≤ VIN ≤ 5.5 V,
10 mA ≤ IOUT ≤ 250 mA		 –1% ±0.5% 1%
ΔVOUT%/ΔVIN Line regulation(1) (VOUT(nom) + 0.5 V) ≤ VIN ≤ 5.5 V 0.06 %/V
ΔVOUT%/ΔIOUT Load regulation 1 mA ≤ IOUT ≤ 250 mA 0.002 %/mA
10 mA ≤ IOUT ≤ 250 mA 0.0008
VDO Dropout voltage
(VIN = VOUT (nom) – 0.1 V)		 IOUT = 250 mA 40 150 mV
ZO(DO) Output impedance in dropout 1.7 V ≤ VIN ≤ (VOUT + VDO) 0.25 Ω
ICL Output current limit VOUT = 0.9 × VOUT(nom) 250 425 600 mA
ISC Short-circuit current VOUT = 0 V 300 mA
IREV Reverse leakage current(3) (–IIN) VEN ≤ 0.5 V, 0 V ≤ VIN ≤ VOUT 0.1 10 μA
IGND Ground pin current IOUT = 10 mA (IQ) 400 550 μA
IOUT = 250 mA 650 950
ISHDN Shutdown current (IGND) VEN ≤ 0.5 V, VOUT ≤ VIN ≤ 5.5 0.02 1 μA
PSRR Power-supply rejection ratio
(ripple rejection)		 f = 100 Hz, IOUT = 250 mA 58 dB
f = 10 kHz, IOUT = 250 mA 37
VN Output noise voltage
BW = 10 Hz – 100 kHz		 COUT = 10 μF, No CNR 27 × VOUT μVRMS
COUT = 10 μF, CNR = 0.01 μF 8.5 × VOUT
VEN(HI) Enable high (enabled) 1.7 VIN V
VEN(LO) Enable low (shutdown) 0 0.5 V
IEN(HI) Enable pin current (enabled) VEN = 5.5 V 0.02 0.1 μA
TSD Thermal shutdown temperature Shutdown, temperature increasing 160 °C
Reset, temperature decreasing 140
(1) Minimum VIN = VOUT + VDO or 1.7 V, whichever is greater.
(2) TPS73201-Q1 is tested at VOUT = 2.5 V.
(3) Fixed-voltage versions only; see Reverse Current for more information.

6.6 Switching Characteristics

Over operating temperature range (TJ = –40°C to 125°C), VIN = VOUT(nom) + 0.5 V(1), IOUT = 10 mA, VEN = 1.7 V, and COUT = 0.1 μF, unless otherwise noted. Typical values are at TJ = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tSTR Start-Up time VOUT = 3 V, RL = 30 Ω COUT = 1 μF, CNR = 0.01 μF 600 μs

6.7 Typical Characteristics

For all voltage versions at TJ = 25°C, VIN = VOUT(nom) + 0.5 V, IOUT = 10 mA, VEN = 1.7 V, and COUT = 0.1 μF, unless otherwise noted
TPS732-Q1 ld_reg_gls303.gif Figure 1. Load Regulation
TPS732-Q1 vdo_v_io_gls303.gif Figure 3. Dropout Voltage vs Output Current
TPS732-Q1 vo_shto_gls303.gif Figure 5. Output Voltage Accuracy Histogram
TPS732-Q1 ignd_v_io_gls303.gif Figure 7. Ground Pin Current vs Output Current
TPS732-Q1 ilimit_v_vo_gls303.gif Figure 9. Current Limit vs VOUT (FOLDBACK)
TPS732-Q1 ilimit_v_vi_gls303.gif Figure 11. Current Limit vs VIN
TPS732-Q1 psrr_v_f_gls303.gif Figure 13. PSRR (Ripple Rejection) vs Frequency
TPS732-Q1 noise_dnsty_gls303.gif Figure 15. Noise Spectral Density vs CNR = 0 μF
TPS732-Q1 vn_v_co_gls303.gif Figure 17. RMS Noise Voltage vs COUT
TPS732-Q1 load_tr_gls303.gif Figure 19. TPS73233-Q1 – Load Transient Response
TPS732-Q1 trn-on_res_gls303.gif Figure 21. TPS73233-Q1 – Turnon Response
TPS732-Q1 pw-up_pw-dn_gls303.gif
Figure 23. TPS73233-Q1 – Power Up and Power Down
TPS732-Q1 vn_v_cbf_gls303.gif Figure 25. TPS73201-Q1 – RMS Noise Voltage vs CADJ
TPS732-Q1 ldtrns_adj_gls303.gif Figure 27. TPS73201-Q1 – Load Transient, Adjustable Version
TPS732-Q1 line_reg_gls303.gif Figure 2. Line Regulation
TPS732-Q1 vdo_v_ta_gls303.gif Figure 4. Dropout Voltage vs Temperature
TPS732-Q1 vo_hsto_dft_gls303.gif Figure 6. Output Voltage Drift Histogram
TPS732-Q1 ignd_v_ta_gls303.gif Figure 8. Ground Pin Current vs Temperature
TPS732-Q1 ignd2_v_ta_gls303.gif Figure 10. Ground Pin Current in Shutdown vs Temperature
TPS732-Q1 ililit_v_ta_gls303.gif Figure 12. Current Limit vs Temperature
TPS732-Q1 psrr_v_vi-vo_gls303.gif Figure 14. PSRR (Ripple Rejection) vs VIN – VOUT
TPS732-Q1 noise2_dnsty_gls303.gif Figure 16. Noise Spectral Density vs CNR = 0.01 μF
TPS732-Q1 vn_cnr_gls303.gif Figure 18. RMS Noise Voltage vs CNR
TPS732-Q1 line_tr_gls303.gif Figure 20. TPS73233-Q1 – Line Transient Response
TPS732-Q1 trn-off_res_gls303.gif Figure 22. TPS73233-Q1 – Turnoff Response
TPS732-Q1 ienab_v_ta_gls303.gif Figure 24. IENABLE vs Temperature
TPS732-Q1 ifb_v_ta_gls303.gif Figure 26. TPS73201-Q1 – IFB vs Temperature
TPS732-Q1 lntrns_adj_gls303.gif Figure 28. TPS73201-Q1 – Line Transient, Adjustable Version