TPS795 (ACTIVE) Ultralow-Noise, High-PSRR, Fast, RF, 500-mA Low-Dropout Linear Regulators

 

Models (3)

Title Category Type Date
TPS79501 TINA-TI Transient Spice Model TINA-TI Spice Model ZIP 03 Apr 2012
TPS79501 TINA-TI Transient Reference Design TINA-TI Reference Design TSC 03 Apr 2012
TPS79501 PSpice Transient Model PSpice Model ZIP 08 Nov 2011

Design kits & evaluation modules (2)

Name Part# Type
DEM-SOT223LDO Compatible with Most Positive Output LDOs in SOT223 (DCQ) Package DEM-SOT223LDO Evaluation Modules & Boards
Evaluation Module for TPS79501 Single Output LDO TPS79501DRBEVM Evaluation Modules & Boards

Reference designs

Valley switching boost power factor correction (PFC) reference design

This reference design illustrates a digital control method to significantly improve Boost Power Factor Correction (PFC) converter performance such as the efficiency and Total Harmonic Distortion (THD) under light load condition where efficiency and THD standards are difficult to meet. This is (...)

View the Important Notice for reference designs covering authorized use, intellectual property matters and disclaimers.

Description Part Number Company Tool Type
Power Management Solution for Virtex-II Pro (Design 4) PR271 Texas Instruments Reference designs
Power Management Solution for Virtex-II Pro™-(Design 1) PR218 Texas Instruments Reference designs
Power Management Solution for Virtex-II Pro™-(Design 2) PR220 Texas Instruments Reference designs
Power Management Solution for Virtex-II Pro™-(Design 3 w/ Sequential Sequencing) PR222 Texas Instruments Reference designs
Power Management Solution for Virtex-II Pro™-(Design 3 w/ Simultaneous Sequencing) PR252 Texas Instruments Reference designs
Power Management Solution for Virtex-II Pro™-(Design 5) PR226 Texas Instruments Reference designs
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Thermal calculator

Estimate the LDO IC temperature at your design conditions:
Part number
    Range
Vin  V
Vout  V
Iout  A
Ambient temp  °C
Package option
Voltage option
PCB construction
Enhanced Thermal = single thermal spreading plane of 1 oz Cu
Minimum Thermal = single thermal spreading plane of 1/2 oz Cu
View the user guide for more details.

Junction temperature vs. PCB copper coverage area
These are estimated power dissipation and thermal results.
Care must be taken to ensure that device junction temperature
does not exeed the maximum ratings as indicated in the datasheet.

This calculator uses the PCB copper area to estimate the device junction temperature. See notes on usage and calculation method.