SBVS263A July   2017  – September 2017 TPS7A39

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Startup Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Voltage Regulation
        1. 7.3.1.1 DC Regulation
        2. 7.3.1.2 AC and Transient Response
      2. 7.3.2 User-Settable Buffered Reference
      3. 7.3.3 Active Discharge
      4. 7.3.4 System Start-Up Controls
        1. 7.3.4.1 Start-Up Tracking
        2. 7.3.4.2 Sequencing
          1. 7.3.4.2.1 Enable (EN)
          2. 7.3.4.2.2 Undervoltage Lockout (UVLO) Control
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Setting the Output Voltages on Adjustable Devices
      2. 8.1.2  Capacitor Recommendations
      3. 8.1.3  Input and Output Capacitor (CINx and COUTx)
      4. 8.1.4  Feed-Forward Capacitor (CFFx)
      5. 8.1.5  Noise-Reduction and Soft-Start Capacitor (CNR/SS)
      6. 8.1.6  Buffered Reference Voltage
      7. 8.1.7  Overriding Internal Reference
      8. 8.1.8  Start-Up
        1. 8.1.8.1 Soft-Start Control (NR/SS)
          1. 8.1.8.1.1 In-Rush Current
        2. 8.1.8.2 Undervoltage Lockout (UVLOx) Control
      9. 8.1.9  AC and Transient Performance
        1. 8.1.9.1 Power-Supply Rejection Ratio (PSRR)
        2. 8.1.9.2 Channel-to-Channel Output Isolation and Crosstalk
        3. 8.1.9.3 Output Voltage Noise
        4. 8.1.9.4 Optimizing Noise and PSRR
        5. 8.1.9.5 Load Transient Response
      10. 8.1.10 DC Performance
        1. 8.1.10.1 Output Voltage Accuracy (VOUTx)
        2. 8.1.10.2 Dropout Voltage (VDO)
      11. 8.1.11 Reverse Current
      12. 8.1.12 Power Dissipation (PD)
        1. 8.1.12.1 Estimating Junction Temperature
    2. 8.2 Typical Applications
      1. 8.2.1 Design 1: Single-Ended to Differential Isolated Supply
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Switcher Choice
          2. 8.2.1.2.2 Full Bridge Rectifier With Center-Tapped Transformer
          3. 8.2.1.2.3 Total Solution Efficiency
          4. 8.2.1.2.4 Feedback Resistor Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Design 2: Getting the Full Range of a SAR ADC
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Detailed Design Description
          1. 8.2.2.3.1 Regulation of -0.2 V
          2. 8.2.2.3.2 Feedback Resistor Selection
        4. 8.2.2.4 Application Curves
  9. 9 Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
    2. 10.2 Layout Example
    3. 10.3 Package Mounting
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
        2. 11.1.1.2 Spice Models
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Development Support

11.1.1.1 Evaluation Modules

An evaluation module (EVM) is available to assist in the initial circuit performance evaluation using the TPS7A39. The TPS7A39EVM-865 evaluation module (and related user guide) can be requested at the Texas Instruments website through the product folder or purchased directly from the TI eStore.

11.1.1.2 Spice Models

Computer simulation of circuit performance using SPICE is often useful when analyzing the performance of analog circuits and systems. A SPICE model for the TPS7A39 is available through the product folder under Tools & Software.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

11.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

11.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.5 Trademarks

E2E is a trademark of Texas Instruments.

Wurth Electronics is a trademark of Würth Elektronik GmbH and Co.

All other trademarks are the property of their respective owners.

11.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.