SLVSDU9A February 2017 – March 2017
For LDO power supplies, especially high-voltage and high-current ones, layout is an important step. If layout is not carefully designed, the regulator could not deliver enough output current because of thermal limitation. To improve the thermal performance of the device and maximize the current output at high ambient temperature, TI recommends spreading the thermal pad as much as possible and putting enough thermal vias on the thermal pad. Figure 29 shows an example layout.