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TS3A4751

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0.9-Ω on-state resistance, 3.3-V, 1:1 (SPST), 4-channel analog switch with 1.8-V input logic

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Data sheet

TS3A4751

ACTIVE
Data sheet Order now

Product details

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 1.8, 2.5, 3.3 Protocols Analog Ron (typ) (Ω) 0.7 CON (typ) (pF) 43 ON-state leakage current (max) (µA) 0.005 Supply current (typ) (µA) 2.5 Bandwidth (MHz) 125 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 100 Rating Catalog Drain supply voltage (max) (V) 3.3 Supply voltage (max) (V) 3.3
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 1.8, 2.5, 3.3 Protocols Analog Ron (typ) (Ω) 0.7 CON (typ) (pF) 43 ON-state leakage current (max) (µA) 0.005 Supply current (typ) (µA) 2.5 Bandwidth (MHz) 125 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 100 Rating Catalog Drain supply voltage (max) (V) 3.3 Supply voltage (max) (V) 3.3
TSSOP (PW) 14 32 mm² 5 x 6.4 VQFN (RGY) 14 12.25 mm² 3.5 x 3.5 X2QFN (RUC) 14 4 mm² 2 x 2
  • Low ON-State Resistance (RON)
    • 0.9 Ω Max (3-V Supply)
    • 1.5 Ω Max (1.8-V Supply)
  • RON Flatness: 0.4 Ω Max (3-V)
  • RON Channel Matching
    • 0.05 Ω Max (3-V Supply)
    • 0.15 Ω Max (1.8-V Supply)
  • 1.6-V to 3.6-V Single-Supply Operation
  • 1.8-V CMOS Logic Compatible (3-V Supply)
  • High Current-Handling Capacity (100 mA Continuous)
  • Fast Switching: tON = 5 ns, tOFF = 4 ns
  • Supports Both Digital and Analog Applications
  • ESD Protection Exceeds JESD-22
    • ±4000-V Human Body Model (A114-A)
    • 300-V Machine Model (A115-A)
    • ±1000-V Charged-Device Model (C101)
  • Low ON-State Resistance (RON)
    • 0.9 Ω Max (3-V Supply)
    • 1.5 Ω Max (1.8-V Supply)
  • RON Flatness: 0.4 Ω Max (3-V)
  • RON Channel Matching
    • 0.05 Ω Max (3-V Supply)
    • 0.15 Ω Max (1.8-V Supply)
  • 1.6-V to 3.6-V Single-Supply Operation
  • 1.8-V CMOS Logic Compatible (3-V Supply)
  • High Current-Handling Capacity (100 mA Continuous)
  • Fast Switching: tON = 5 ns, tOFF = 4 ns
  • Supports Both Digital and Analog Applications
  • ESD Protection Exceeds JESD-22
    • ±4000-V Human Body Model (A114-A)
    • 300-V Machine Model (A115-A)
    • ±1000-V Charged-Device Model (C101)

The TS3A4751 device is a bidirectional, 4-channel, normally open (NO) single-pole single-throw (SPST) analog switch that operates from a single 1.6-V to 3.6-V supply. This device has fast switching speeds, handles rail-to-rail analog signals, and consumes very low quiescent power.

The digital input is 1.8-V CMOS compatible when using a 3-V supply.

The TS3A4751 device has four normally open (NO) switches. The TS3A4751 is available in a 14-pin thin shrink small-outline package (TSSOP) and in space-saving 14-pin VQFN (RGY) and micro X2QFN (RUC) packages.

The TS3A4751 device is a bidirectional, 4-channel, normally open (NO) single-pole single-throw (SPST) analog switch that operates from a single 1.6-V to 3.6-V supply. This device has fast switching speeds, handles rail-to-rail analog signals, and consumes very low quiescent power.

The digital input is 1.8-V CMOS compatible when using a 3-V supply.

The TS3A4751 device has four normally open (NO) switches. The TS3A4751 is available in a 14-pin thin shrink small-outline package (TSSOP) and in space-saving 14-pin VQFN (RGY) and micro X2QFN (RUC) packages.
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Technical documentation

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Type Title Date
* Data sheet TS3A4751 0.9-Ω Low-voltage, single-supply, 4-channel spst analog switch datasheet (Rev. F) PDF | HTML 26 Mar 2019
Application brief 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) PDF | HTML 26 Jul 2022
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 Jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 Dec 2021
Application note Preventing Excess Power Consumption on Analog Switches 03 Jul 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004

Design & development

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The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
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TSSOP (PW) 14 View options
VQFN (RGY) 14 View options
X2QFN (RUC) 14 View options
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