• General
  • Integrates RF, Power Amplifiers (PAs), Clock, RF Switches, Filters, Passives, and Power Management
  • Quick Hardware Design With TI Module Collateral and Reference Designs
  • Operating Temperature: –20°C to +70°C
  • Small Form Factor: 13.3 × 13.4 × 2 mm
  • 100-Pin MOC Package
  • FCC, IC, ETSI/CE, and TELEC Certified With PCB, Dipole, Chip, and PIFA Antennas
• Wi-Fi^®
  • WLAN Baseband Processor and RF Transceiver Support of IEEE Std 802.11b, 802.11g, and 802.11n
  • 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for High Throughput: 80 Mbps (TCP), 100 Mbps (UDP)
  • 2.4-GHz MRC Support for Extended Range
  • Fully Calibrated: Production Calibration Not Required
  • 4-Bit SDIO Host Interface Support
  • Wi-Fi Direct Concurrent Operation (Multichannel, Multirole)
• Bluetooth^® and Bluetooth low energy (WL183xMOD Only)
  • Bluetooth 4.2 Secure Connection Compliant and CSA2 Support (Declaration ID: D032799)
  • Host Controller Interface (HCI) Transport for Bluetooth Over UART
  • Dedicated Audio Processor Support of SBC Encoding + A2DP
  • Dual-Mode Bluetooth and Bluetooth Low Energy
  • TI’s Bluetooth- and Bluetooth Low Energy-Certified Stack
• Key Benefits
  • Reduces Design Overhead
  • Differentiated Use Cases by Configuring WiLink™ 8 Simultaneously in Two Roles (STA and AP) to Connect Directly With Other Wi-Fi Devices on Different RF Channel (Wi-Fi Networks)
  • Best-in-Class Wi-Fi With High-Performance Audio and Video Streaming Reference Applications With Up to 1.4× the Range Versus One Antenna
  • Different Provisioning Methods for In-Home Devices Connectivity to Wi-Fi in One Step
  • Lowest Wi-Fi Power Consumption in Connected Idle (< 800 µA)
  • Configurable Wake on WLAN Filters to Only Wake Up the System
  • Wi-Fi-Bluetooth Single Antenna Coexistence

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