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CSD97370Q5M

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30 V 25 A SON 5 x 6 mm synchronous buck NexFET™ power stage

Product details

VDS (V) 30 Power loss (W) 2.8 Ploss current (A) 25 Configuration PowerStage ID - continuous drain current at TA=25°C (A) 40 Operating temperature range (°C) -55 to 150 Features Ultra-low inductance package Rating Catalog
VDS (V) 30 Power loss (W) 2.8 Ploss current (A) 25 Configuration PowerStage ID - continuous drain current at TA=25°C (A) 40 Operating temperature range (°C) -55 to 150 Features Ultra-low inductance package Rating Catalog
LSON-CLIP (DQP) 22 30 mm² 6 x 5
  • 90% System Efficiency at 25A
  • Input Voltages up to 22V
  • High Frequency Operation (Up To 2MHz)
  • Incorporates Power Block Technology
  • High Density – SON 5-mm × 6-mm Footprint
  • Low Power Loss 2.8W at 25A
  • Ultra Low Inductance Package
  • System Optimized PCB Footprint
  • 3.3V and 5V PWM Signal Compatible
  • 3-State PWM Input
  • Integrated Bootstrap Diode
  • Pre-Bias Start-Up Protection
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating Halogen Free
  • 90% System Efficiency at 25A
  • Input Voltages up to 22V
  • High Frequency Operation (Up To 2MHz)
  • Incorporates Power Block Technology
  • High Density – SON 5-mm × 6-mm Footprint
  • Low Power Loss 2.8W at 25A
  • Ultra Low Inductance Package
  • System Optimized PCB Footprint
  • 3.3V and 5V PWM Signal Compatible
  • 3-State PWM Input
  • Integrated Bootstrap Diode
  • Pre-Bias Start-Up Protection
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating Halogen Free

The CSD97370Q5M NexFET Power Stage is an optimized design for use in a high power, high density Synchronous Buck converter. This product integrates an enhanced gate driver IC and Power Block Technology to complete the power stage switching function. This combination produces a high current, high efficiency, high speed switching device and delivers an excellent thermal solution in a small 5-mm × 6-mm outline package due to its large ground based thermal pad. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD97370Q5M NexFET Power Stage is an optimized design for use in a high power, high density Synchronous Buck converter. This product integrates an enhanced gate driver IC and Power Block Technology to complete the power stage switching function. This combination produces a high current, high efficiency, high speed switching device and delivers an excellent thermal solution in a small 5-mm × 6-mm outline package due to its large ground based thermal pad. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

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Technical documentation

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Type Title Date
* Data sheet Synchronous Buck NexFET™ Power Stage - CSD97370Q5M datasheet (Rev. C) 22 Feb 2012
Selection guide Power Management Guide 2018 (Rev. R) 25 Jun 2018

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation model

CSD97370Q5M PSpice Transient Model

SLPM193.ZIP (16 KB) - PSpice Model
Simulation model

CSD97370Q5M TINA-TI Spice Transient Model

SLPM256.ZIP (13 KB) - TINA-TI Spice Model
Package Pins Download
LSON-CLIP (DQP) 22 View options

Ordering & quality

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