Product details

Resolution (Bits) 12 Number of DAC channels 2 Interface type Parallel CMOS Sample/update rate (Msps) 200 Features Low Power Rating HiRel Enhanced Product Interpolation 1x Power consumption (typ) (mW) 330 SFDR (dB) 85 Architecture Current Source Operating temperature range (°C) -55 to 125 Reference type Ext
Resolution (Bits) 12 Number of DAC channels 2 Interface type Parallel CMOS Sample/update rate (Msps) 200 Features Low Power Rating HiRel Enhanced Product Interpolation 1x Power consumption (typ) (mW) 330 SFDR (dB) 85 Architecture Current Source Operating temperature range (°C) -55 to 125 Reference type Ext
TQFP (PFB) 48 81 mm² 9 x 9
  • Controlled Baseline
    • One Assembly
    • One Test Site
    • One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • 12-Bit Dual Transmit Digital-to-Analog Converter (DAC)
  • 200-MSPS Update Rate
  • Single Supply: 3 V to 3.6 V
  • High Spurious-Free Dynamic Range (SFDR): 85 dBc at 5 MHz
  • High Third-Order Two-Tone Intermodulation (IMD3): 78 dBc at 15.1 and 16.1 MHz
  • WCDMA Adjacent Channel Leakage Ratio (ACLR): 70 dB at 30.72 MHz
  • Independent or Single Resistor Gain Control
  • Dual or Interleaved Data
  • On-Chip 1.2-V Reference
  • Low Power: 330 mW
  • Power-Down Mode: 15 mW
  • Package: 48-Pin Thin Quad Flat Pack (TQFP)
  • APPLICATIONS
    • Cellular Base Transceiver Station Transmit Channel
      • CDMA: W-CDMA, CDMA2000, IS-95
      • TDMA: GSM, IS-136, EDGE/UWC-136
    • Medical/Test Instrumentation
    • Arbitrary Waveform Generators (ARB)
    • Direct Digital Synthesis (DDS)
    • Cable Modem Termination System (CMTS)

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

  • Controlled Baseline
    • One Assembly
    • One Test Site
    • One Fabrication Site
  • Extended Temperature Performance of -55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • 12-Bit Dual Transmit Digital-to-Analog Converter (DAC)
  • 200-MSPS Update Rate
  • Single Supply: 3 V to 3.6 V
  • High Spurious-Free Dynamic Range (SFDR): 85 dBc at 5 MHz
  • High Third-Order Two-Tone Intermodulation (IMD3): 78 dBc at 15.1 and 16.1 MHz
  • WCDMA Adjacent Channel Leakage Ratio (ACLR): 70 dB at 30.72 MHz
  • Independent or Single Resistor Gain Control
  • Dual or Interleaved Data
  • On-Chip 1.2-V Reference
  • Low Power: 330 mW
  • Power-Down Mode: 15 mW
  • Package: 48-Pin Thin Quad Flat Pack (TQFP)
  • APPLICATIONS
    • Cellular Base Transceiver Station Transmit Channel
      • CDMA: W-CDMA, CDMA2000, IS-95
      • TDMA: GSM, IS-136, EDGE/UWC-136
    • Medical/Test Instrumentation
    • Arbitrary Waveform Generators (ARB)
    • Direct Digital Synthesis (DDS)
    • Cable Modem Termination System (CMTS)

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

The DAC5662 is a monolithic, dual-channel 12-bit, high-speed digital-to-analog converter (DAC) with on-chip voltage reference.

Operating with update rates of up to 200 MSPS, the DAC5662 offers exceptional dynamic performance, tight gain, and offset matching characteristics that make it suitable in either I/Q baseband or direct IF communication applications.

Each DAC has a high-impedance differential-current output, suitable for single-ended or differential analog-output configurations. External resistors allow scaling the full-scale output current for each DAC separately or together, typically between 2 mA and 20 mA. An accurate on-chip voltage reference is temperature compensated and delivers a stable 1.2-V reference voltage. Optionally, an external reference may be used.

The DAC5662 has two 12-bit parallel input ports with separate clocks and data latches. For flexibility, the DAC5662 also supports multiplexed data for each DAC on one port when operating in the interleaved mode.

The DAC5662 has been specifically designed for a differential transformer coupled output with a 50- doubly terminated load. For a 20-mA full-scale output current a 4:1 impedance ratio (resulting in an output power of 4 dBm) and 1:1 impedance ratio transformer (-2-dBm output power) are supported.

The DAC5662 is available in a 48-pin thin quad flat pack (TQFP). Pin compatibility between family members provides 12-bit (DAC5662) and 14-bit (DAC5672) resolution. Furthermore, the DAC5662 is pin compatible to the DAC2902 and AD9765 dual DACs. The device is characterized for operation over the military temperature range of -55°C to 125°C.

The DAC5662 is a monolithic, dual-channel 12-bit, high-speed digital-to-analog converter (DAC) with on-chip voltage reference.

Operating with update rates of up to 200 MSPS, the DAC5662 offers exceptional dynamic performance, tight gain, and offset matching characteristics that make it suitable in either I/Q baseband or direct IF communication applications.

Each DAC has a high-impedance differential-current output, suitable for single-ended or differential analog-output configurations. External resistors allow scaling the full-scale output current for each DAC separately or together, typically between 2 mA and 20 mA. An accurate on-chip voltage reference is temperature compensated and delivers a stable 1.2-V reference voltage. Optionally, an external reference may be used.

The DAC5662 has two 12-bit parallel input ports with separate clocks and data latches. For flexibility, the DAC5662 also supports multiplexed data for each DAC on one port when operating in the interleaved mode.

The DAC5662 has been specifically designed for a differential transformer coupled output with a 50- doubly terminated load. For a 20-mA full-scale output current a 4:1 impedance ratio (resulting in an output power of 4 dBm) and 1:1 impedance ratio transformer (-2-dBm output power) are supported.

The DAC5662 is available in a 48-pin thin quad flat pack (TQFP). Pin compatibility between family members provides 12-bit (DAC5662) and 14-bit (DAC5672) resolution. Furthermore, the DAC5662 is pin compatible to the DAC2902 and AD9765 dual DACs. The device is characterized for operation over the military temperature range of -55°C to 125°C.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 4
Type Title Date
* Data sheet DAC5662-EP datasheet (Rev. A) 10 Oct 2006
* Radiation & reliability report DAC5662MPFBREP Reliability Report 16 Aug 2016
* VID DAC5662-EP VID V6206651 21 Jun 2016
Application note High Speed, Digital-to-Analog Converters Basics (Rev. A) 23 Oct 2012

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Package Pins Download
TQFP (PFB) 48 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos