DS90LV028A 600 Mbps LVDS Dual High Speed Differential Receiver | TI.com

DS90LV028A (ACTIVE)

600 Mbps LVDS Dual High Speed Differential Receiver

 

Recommended alternative parts

  • DS90LV027A  -  Companion dual high speed LVDS driver
  • DS90LV048A  -  Higher Channel Count
  • DS90LV032A  - The device has SIMILAR FUNCTIONALITY but is not functionally equivalent to the compared device. 

Description

The DS90LV028A is a dual CMOS differential line receiver designed for applications requiring ultra low power dissipation, low noise and high data rates. The device is designed to support data rates in excess of 400-Mbps (200 MHz) utilizing Low Voltage Differential Signaling (LVDS) technology.

The DS90LV028A accepts low voltage (350 mV typical) differential input signals and translates them to 3-V CMOS output levels. The receiver also supports open, shorted and terminated (100 Ω) input fail-safe. The receiver output is HIGH for all fail-safe conditions. The DS90LV028A has a flow-through design for easy PCB layout.

The DS90LV028A and companion LVDS line driver provide a new alternative to high power PECL/ECL devices for high speed point-to-point interface applications.

Features

  • >400-Mbps (200 MHz) Switching Rates
  • 50-ps Differential Skew (Typical)
  • 0.1-ns Channel-to-Channel Skew (Typical)
  • 2.5-ns Maximum Propagation Delay
  • 3.3-V Power Supply Design
  • Flow-Through Pinout
  • Power Down High Impedance on LVDS Inputs
  • Low Power Design (18 mW at 3.3-V static)
  • Interoperable with Existing 5-V LVDS Networks
  • Accepts Small Swing (350 mV Typical) Differential
    Signal Levels
  • Supports Open, Short and Terminated Input Fail-
    Safe
  • Conforms to ANSI/TIA/EIA-644 Standard
  • Industrial Temperature Operating Range: –40°C
    to 85°C
  • Available in SOIC and Space Saving WSON
    Package

View more

Parametrics Compare all products in Buffers, drivers/receivers & cross-points

 
Device type
Protocols
Number of Tx
Number of Rx
Input signal
Output signal
Signaling Rate (Mbps)
ESD HBM (kV)
Function
Operating temperature range (C)
Package Group
Package size: mm2:W x L (PKG)
DS90LV028A DS90LV012A DS90LV028AQ-Q1 DS90LV032A DS90LV048A SN65LVDS2 SN65LVDS349 SN65LVDS9637
Receiver     Receiver     Receiver     Receiver     Receiver     Receiver     Receiver     Receiver    
LVDS     M-LVDS     LVDS     LVDS     LVDS     LVDS     LVDS     LVDS    
0     0     0     0     0     0     0     0    
2     1     2     4     4     1     4     2    
LVDS     LVDS
BLVDS
LVPECL    
LVDS     LVDS     LVDS     LVDS     CMOS
ECL
LVCMOS
LVDS
LVECL
LVPECL
PECL    
LVDS    
TTL
LVTTL    
CMOS     TTL
LVTTL    
LVCMOS     TTL
LVTTL    
LVTTL     LVTTL     LVTTL    
400     400     400     400     400     400     560     150    
7     2     8     4.5     10     9     15     8    
Receiver     Receiver     Receiver     Receiver     Receiver     Receiver     Receiver     Receiver    
-40 to 85     -40 to 85     -40 to 125     -40 to 85     -40 to 85     -40 to 85     -40 to 85     -40 to 85    
SOIC | 8
WSON | 8    
SOT-23 | 5     SOIC | 8     SOIC | 16
TSSOP | 16    
SOIC | 16
TSSOP | 16    
SOIC | 8
SOT-23 | 5    
TSSOP | 16     MSOP-PowerPAD | 8
SOIC | 8
VSSOP | 8    
8SOIC: 29 mm2: 6 x 4.9 (SOIC | 8)
See datasheet (WSON)    
5SOT-23: 8 mm2: 2.8 x 2.9 (SOT-23 | 5)     8SOIC: 29 mm2: 6 x 4.9 (SOIC | 8)     16SOIC: 59 mm2: 6 x 9.9 (SOIC | 16)
16TSSOP: 22 mm2: 4.4 x 5 (TSSOP | 16)    
16SOIC: 59 mm2: 6 x 9.9 (SOIC | 16)
16TSSOP: 22 mm2: 4.4 x 5 (TSSOP | 16)    
8SOIC: 29 mm2: 6 x 4.9 (SOIC | 8)
5SOT-23: 8 mm2: 2.8 x 2.9 (SOT-23 | 5)    
16TSSOP: 22 mm2: 4.4 x 5 (TSSOP | 16)     8MSOP-PowerPAD: 15 mm2: 4.9 x 3 (MSOP-PowerPAD | 8)
8SOIC: 29 mm2: 6 x 4.9 (SOIC | 8)
8VSSOP: 15 mm2: 4.9 x 3 (VSSOP | 8)