Product details

Operating temperature range (°C) -40 to 85 Rating Catalog
Operating temperature range (°C) -40 to 85 Rating Catalog
NFBGA (NZB) 60 54 mm² 9 x 6

    The LMX5453 is a drop in replacement for the LMX5452.
    The LMX5453 has new features added:

  • eSCO
  • eSCO over USB HCI transport
  • Enhanced scatternet
  • Interlaced scan
  • Flushing
  • Audio PCM slave mode support
  • Generic PCM configuration
  • Compliant with the Bluetooth 2.0 Core Specification
  • Better than –80 dBm input sensitivity
  • Class 2 operation
  • Low power consumption:
  • Accepts external clock or crystal input:
    • Clocking option 12/13 MHz with PLL bypass mode for
      power reduction
    • 10-20 MHz external clock or crystal network
    • Secondary 32.768 kHz oscillator for low-power modes
    • Advanced power management features
  • High integration:
    • Implemented in 0.18 µm CMOS technology
    • RF includes on-chip antenna filter and switch
  • On-chip firmware with complete HCI
  • Embedded ROM (200K) and Patch RAM (16.6K) memory
  • Up to 7 Asynchronous Connection Less (ACL) links
  • Support for two simultaneous voice or Extended
    Synchronous Connection Oriented (eSCO) and
    Synchronous Connection Oriented (SCO) and
    links.
  • Enhanced scatternet
  • Interlaced scan
  • Flushing
  • Audio PCM slave mode support
  • Generic PCM configuration
  • Fractional-N Sigma/Delta modulator
  • Operating voltage range 2.5–3.6V
  • I/O voltage range 1.6–3.6V
  • 60-pad micro-module BGA package (6.1 mm × 9.1 mm × 1.2 mm)

    The LMX5453 is a drop in replacement for the LMX5452.
    The LMX5453 has new features added:

  • eSCO
  • eSCO over USB HCI transport
  • Enhanced scatternet
  • Interlaced scan
  • Flushing
  • Audio PCM slave mode support
  • Generic PCM configuration
  • Compliant with the Bluetooth 2.0 Core Specification
  • Better than –80 dBm input sensitivity
  • Class 2 operation
  • Low power consumption:
  • Accepts external clock or crystal input:
    • Clocking option 12/13 MHz with PLL bypass mode for
      power reduction
    • 10-20 MHz external clock or crystal network
    • Secondary 32.768 kHz oscillator for low-power modes
    • Advanced power management features
  • High integration:
    • Implemented in 0.18 µm CMOS technology
    • RF includes on-chip antenna filter and switch
  • On-chip firmware with complete HCI
  • Embedded ROM (200K) and Patch RAM (16.6K) memory
  • Up to 7 Asynchronous Connection Less (ACL) links
  • Support for two simultaneous voice or Extended
    Synchronous Connection Oriented (eSCO) and
    Synchronous Connection Oriented (SCO) and
    links.
  • Enhanced scatternet
  • Interlaced scan
  • Flushing
  • Audio PCM slave mode support
  • Generic PCM configuration
  • Fractional-N Sigma/Delta modulator
  • Operating voltage range 2.5–3.6V
  • I/O voltage range 1.6–3.6V
  • 60-pad micro-module BGA package (6.1 mm × 9.1 mm × 1.2 mm)

The LMX5453 is a highly integrated Bluetooth 2.0 compliant solution. The integrated baseband controller and 2.4 GHz radio combine to form a complete, small form-factor (6.1 mm × 9.1 mm × 1.2 mm) Bluetooth node.

The on-chip memory, ROM, and Patch RAM provide lowest cost and minimize design risk with the flexibility of firmware upgrades.

The firmware supplied in the on-chip ROM supports a complete Bluetooth Link Manager and HCI with communication through a UART or USB interface. This firmware features point-to-point and point-to-multipoint link management, supporting data rates up to 723 kbps.

The radio employs an integrated antenna filter and switch to minimize the number of external components.

The radio has a heterodyne receiver architecture with a low intermediate frequency (IF), which enables the IF filters to be integrated on-chip. The transmitter uses direct IQ-modulation with Gaussian-filtered bit-stream data, a voltage-controlled oscillator (VCO) buffer, and a power amplifier.

The LMX5453 module is lead free and RoHS (Restriction of Hazardous Substances) compliant. For more information on those quality standards, please visit our green compliance website at ** http://www.national.com/quality/green/

The LMX5453 is a highly integrated Bluetooth 2.0 compliant solution. The integrated baseband controller and 2.4 GHz radio combine to form a complete, small form-factor (6.1 mm × 9.1 mm × 1.2 mm) Bluetooth node.

The on-chip memory, ROM, and Patch RAM provide lowest cost and minimize design risk with the flexibility of firmware upgrades.

The firmware supplied in the on-chip ROM supports a complete Bluetooth Link Manager and HCI with communication through a UART or USB interface. This firmware features point-to-point and point-to-multipoint link management, supporting data rates up to 723 kbps.

The radio employs an integrated antenna filter and switch to minimize the number of external components.

The radio has a heterodyne receiver architecture with a low intermediate frequency (IF), which enables the IF filters to be integrated on-chip. The transmitter uses direct IQ-modulation with Gaussian-filtered bit-stream data, a voltage-controlled oscillator (VCO) buffer, and a power amplifier.

The LMX5453 module is lead free and RoHS (Restriction of Hazardous Substances) compliant. For more information on those quality standards, please visit our green compliance website at ** http://www.national.com/quality/green/

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Technical documentation

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* Data sheet LMX5453 Micro-Module Integrated Bluetooth 2.0 Baseband Controller and Radio datasheet (Rev. D) 24 Jan 2014

Design & development

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Reference designs

TIDA-00186 — Complete Bluetooth wireless audio communication system - Headset and Handsfree

This reference design offers a complete wireless audio solution using the fully certified LMX9838 Bluetooth module. With Bluetooth Headset and Handsfree profiles implemented, the design is perfect for mono audio communication and control. With the support of an orderable evaluation module, built-in (...)
Test report: PDF
Schematic: PDF
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NFBGA (NZB) 60 View options

Ordering & quality

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  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

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