OMAP3530 and OMAP3525 devices are based on the enhanced OMAP 3 architecture.

The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:

• Streaming video
• Video conferencing
• High-resolution still image

The device supports high-level operating systems (HLOSs), such as:

• Linux®
• Windows® CE
• Android™

This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.

The following subsystems are part of the device:

• Microprocessor unit (MPU) subsystem based on the ARM Cortex-A8 microprocessor
• IVA2.2 subsystem with a C64x+ digital signal processor (DSP) core
• PowerVR SGX subsystem for 3D graphics acceleration to support display (OMAP3530 device only)
• Camera image signal processor (ISP) that supports multiple formats and interfacing options connected to a wide variety of image sensors
• Display subsystem with a wide variety of features for multiple concurrent image manipulation, and a programmable interface supporting a wide variety of displays. The display subsystem also supports NTSC and PAL video out.
• Level 3 (L3) and level 4 (L4) interconnects that provide high-bandwidth data transfers for multiple initiators to the internal and external memory controllers and to on-chip peripherals

The device also offers:

• A comprehensive power- and clock-management scheme that enables high-performance, low-power operation, and ultralow-power standby features. The device also supports SmartReflex adaptative voltage control. This power-management technique for automatic control of the operating voltage of a module reduces the active power consumption.
• Memory-stacking feature using the package-on-package (POP) implementation (CBB and CBC packages only)

OMAP3530 and OMAP3525 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package. (See Table 1-1 for package differences).

This data manual presents the electrical and mechanical specifications for the OMAP3530 and OMAP3525 applications processors. The information in this data manual applies to both the commercial and extended temperature versions of the OMAP3530 and OMAP3525 applications processors unless otherwise indicated. This data manual consists of the following sections:

• Section 2: Terminal Description: assignment, electrical characteristics, multiplexing, and functional description
• Section 3: Electrical Characteristics: power domains, operating conditions, power consumption, and DC characteristics
• Section 4: Clock Specifications input and output clocks, DPLL and DLL
• Section 5: Video Dac Specifications
• Section 6: Timing Requirements and Switching Characteristics
• Section 7: Package Characteristics: thermal characteristics, device nomenclature, and mechanical data for available packaging