Silicon revision 3.1.2 is now available. This revision addresses errata that is detailed in the Silicon Errata documentation. Devices with this silicon have an E in the part number. (e.g., OMAP3530ECBB)
OMAP3530 and OMAP3525 devices are based on the enhanced OMAP 3 architecture.
The OMAP 3 architecture is designed to provide best-in-class video, image, and graphics processing sufficient to support the following:
The device supports high-level operating systems (HLOSs), such as:
This OMAP device includes state-of-the-art power-management techniques required for high-performance mobile products.
The following subsystems are part of the device:
The device also offers:
OMAP3530 and OMAP3525 devices are available in a 515-pin s-PBGA package (CBB suffix), 515-pin s-PBGA package (CBC suffix), and a 423-pin s-PBGA package (CUS suffix). Some features of the CBB and CBC packages are not available in the CUS package. (See Table 1-1 for package differences).
This data manual presents the electrical and mechanical specifications for the OMAP3530 and OMAP3525 applications processors. The information in this data manual applies to both the commercial and extended temperature versions of the OMAP3530 and OMAP3525 applications processors unless otherwise indicated. This data manual consists of the following sections:
|ARM MHz (Max.)|
|2D & 3D Graphics|
|Memory Interface (Dual Channel)|
|Integrated TI C64x DSP|
|1 ARM Cortex-A8|
|1 16-bit LPDDR , 1 32-bit SDRC|
|Up to 520 MHz|
|Sample & Buy|