Product details

Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 1 IOL (max) (mA) 4 Supply current (max) (µA) 0.9 IOH (max) (mA) 0 Input type Standard CMOS Output type Open-drain Features Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AUP Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 3.6 Number of channels 1 IOL (max) (mA) 4 Supply current (max) (µA) 0.9 IOH (max) (mA) 0 Input type Standard CMOS Output type Open-drain Features Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YFP) 4 1 mm² 1 x 1 DSBGA (YZP) 5 2.1875 mm² 1.75 x 1.25 SOT-23 (DBV) 5 8.12 mm² 2.9 x 2.8 SOT-5X3 (DRL) 5 2.56 mm² 1.6 x 1.6 SOT-SC70 (DCK) 5 4.2 mm² 2 x 2.1 USON (DRY) 6 1.45 mm² 1.45 x 1 X2SON (DPW) 5 0.64 mm² 0.8 x 0.8 X2SON (DSF) 6 1 mm² 1 x 1
  • Available in the Ultra Small 0.64 mm2 Package (DPW) with 0.5-mm Pitch
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 1 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the Input
    (Vhys = 250 mV Typ at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 3.3 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Available in the Ultra Small 0.64 mm2 Package (DPW) with 0.5-mm Pitch
  • Low Static-Power Consumption
    (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption
    (Cpd = 1 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot
    <10% of VCC
  • Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
  • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at the Input
    (Vhys = 250 mV Typ at 3.3 V)
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 3.3 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

The SN74AUP1G07 device is a single buffer gate with open drain output that operates from 0.8 V to 3.6 V.

The SN74AUP1G07 device is a single buffer gate with open drain output that operates from 0.8 V to 3.6 V.

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Technical documentation

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Type Title Date
* Data sheet SN74AUP1G07 Low-Power Single Buffer/Driver With Open-Drain Outputs datasheet (Rev. J) PDF | HTML 13 Dec 2013
Application brief Understanding Schmitt Triggers (Rev. A) PDF | HTML 22 May 2019
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Application note Designing and Manufacturing with TI's X2SON Packages 23 Aug 2017
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

5-8-LOGIC-EVM — Generic logic evaluation module for 5-pin to 8-pin DCK, DCT, DCU, DRL and DBV packages

Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
User guide: PDF
Not available on TI.com
Simulation model

SN74AUP1G07 Behavioral SPICE Model

SCEM691.ZIP (7 KB) - PSpice Model
Simulation model

SN74AUP1G07 IBIS Model

SCEM443.ZIP (48 KB) - IBIS Model
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Schematic: PDF
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Schematic: PDF
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TIDA-01226 — Compact Full HD 1080p (up to 16 Amps) Projection Display Reference Design Using DLP Pico Technology

This reference design, featuring the DLP Pico™ 0.47-inch TRP Full-HD 1080p display chipset and implemented in the DLP LightCrafter Display 4710 G2 evaluation module (EVM), enables use of full HD resolution for projection display applications such as accessory projectors, screenless displays, (...)
Design guide: PDF
Schematic: PDF
Reference designs

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Design guide: PDF
Schematic: PDF
Package Pins Download
DSBGA (YFP) 4 View options
DSBGA (YZP) 5 View options
SOT-23 (DBV) 5 View options
SOT-5X3 (DRL) 5 View options
SOT-SC70 (DCK) 5 View options
USON (DRY) 6 View options
X2SON (DPW) 5 View options
X2SON (DSF) 6 View options

Ordering & quality

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  • Ongoing reliability monitoring
Information included:
  • Fab location
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Support & training

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