SN74LVC1G3157-Q1

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Product details

Configuration 2:1 SPDT Number of channels 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog Ron (typ) (Ω) 6 CON (typ) (pF) 17.3 ON-state leakage current (max) (µA) 1 Supply current (typ) (µA) 1 Bandwidth (MHz) 300 Operating temperature range (°C) -40 to 125 Input/output continuous current (max) (mA) 128 Rating Automotive Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
Configuration 2:1 SPDT Number of channels 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog Ron (typ) (Ω) 6 CON (typ) (pF) 17.3 ON-state leakage current (max) (µA) 1 Supply current (typ) (µA) 1 Bandwidth (MHz) 300 Operating temperature range (°C) -40 to 125 Input/output continuous current (max) (mA) 128 Rating Automotive Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
SOT-23 (DBV) 6 8.12 mm² 2.9 x 2.8 SOT-SC70 (DCK) 6 4.2 mm² 2 x 2.1
  • Functional safety-capable
  • AEC-Q100 qualified for automotive applications:
    • Temperature grade 1: –40°C to +125°C, TA
  • ESD protection exceeds 2000 V per MIL-STD-883, method 3015; exceeds 200 V using machine model (C = 200 pF, R = 0)
  • 1.65-V to 5.5-V VCC operation
  • Useful for analog and digital applications
  • Specified break-before-make switching
  • Rail-to-rail signal handling
  • High degree of linearity
  • High speed, typically 0.5 ns (VCC = 3 V, CL = 50 pF)
  • Low ON-State resistance, typically ≉6 Ω (VCC = 4.5 V)
  • Latch-up performance exceeds 100 mA per JESD 78, Class II
  • Functional safety-capable
  • AEC-Q100 qualified for automotive applications:
    • Temperature grade 1: –40°C to +125°C, TA
  • ESD protection exceeds 2000 V per MIL-STD-883, method 3015; exceeds 200 V using machine model (C = 200 pF, R = 0)
  • 1.65-V to 5.5-V VCC operation
  • Useful for analog and digital applications
  • Specified break-before-make switching
  • Rail-to-rail signal handling
  • High degree of linearity
  • High speed, typically 0.5 ns (VCC = 3 V, CL = 50 pF)
  • Low ON-State resistance, typically ≉6 Ω (VCC = 4.5 V)
  • Latch-up performance exceeds 100 mA per JESD 78, Class II

The SN74LVC1G3157-Q1 device is a single-pole double-throw (SPDT) analog switch designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G3157 device can handle analog and digital signals. The device permits signals with amplitudes of up to VCC (peak) to be transmitted in either direction.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

The SN74LVC1G3157-Q1 device is a single-pole double-throw (SPDT) analog switch designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G3157 device can handle analog and digital signals. The device permits signals with amplitudes of up to VCC (peak) to be transmitted in either direction.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

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Technical documentation

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Type Title Date
* Data sheet SN74LVC1G3157-Q1 Automotive Single-Pole Double-Throw Analog Switch datasheet (Rev. H) PDF | HTML 08 Dec 2021
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 Jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 Dec 2021
Functional safety information SN74LVC1G3157-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin PDF | HTML 04 Oct 2021
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
More literature Automotive Logic Devices Brochure 27 Aug 2014
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 Nov 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 Dec 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 May 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 May 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mar 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note LVC Characterization Information 01 Dec 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 Sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996

Design & development

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Evaluation board

DIP-ADAPTER-EVM — DIP adapter evaluation module

Speed up your op amp prototyping and testing with the DIP adapter evaluation module (DIP-ADAPTER-EVM), which provides a fast, easy and inexpensive way to interface with small surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them (...)

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SOT-23 (DBV) 6 View options
SOT-SC70 (DCK) 6 View options

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