SBOS762B November 2016  – June 2017 TMP468

PRODUCTION DATA. 

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1Absolute Maximum Ratings
    2. 6.2ESD Ratings
    3. 6.3Recommended Operating Conditions
    4. 6.4Thermal Information
    5. 6.5Electrical Characteristics
    6. 6.6Two-Wire Timing Requirements
    7. 6.7Typical Characteristics
  7. Detailed Description
    1. 7.1Overview
    2. 7.2Functional Block Diagram
    3. 7.3Feature Description
      1. 7.3.1Temperature Measurement Data
      2. 7.3.2Series Resistance Cancellation
      3. 7.3.3Differential Input Capacitance
      4. 7.3.4Sensor Fault
      5. 7.3.5 THERM Functions
    4. 7.4Device Functional Modes
      1. 7.4.1Shutdown Mode (SD)
    5. 7.5Programming
      1. 7.5.1Serial Interface
        1. 7.5.1.1Bus Overview
        2. 7.5.1.2Bus Definitions
        3. 7.5.1.3Serial Bus Address
        4. 7.5.1.4Read and Write Operations
          1. 7.5.1.4.1Single Register Reads
          2. 7.5.1.4.2Block Register Reads
        5. 7.5.1.5Timeout Function
        6. 7.5.1.6High-Speed Mode
      2. 7.5.2TMP468 Register Reset
      3. 7.5.3Lock Register
    6. 7.6Register Maps
      1. 7.6.1Register Information
        1. 7.6.1.1 Pointer Register
        2. 7.6.1.2 Local and Remote Temperature Value Registers
        3. 7.6.1.3 Software Reset Register
        4. 7.6.1.4 THERM Status Register
        5. 7.6.1.5 THERM2 Status Register
        6. 7.6.1.6 Remote Channel Open Status Register
        7. 7.6.1.7 Configuration Register
        8. 7.6.1.8 η-Factor Correction Register
        9. 7.6.1.9 Remote Temperature Offset Register
        10. 7.6.1.10THERM Hysteresis Register
        11. 7.6.1.11Local and Remote THERM and THERM2 Limit Registers
        12. 7.6.1.12Block Read - Auto Increment Pointer
        13. 7.6.1.13Lock Register
        14. 7.6.1.14Manufacturer and Device Identification Plus Revision Registers
  8. Application and Implementation
    1. 8.1Application Information
    2. 8.2Typical Application
      1. 8.2.1Design Requirements
      2. 8.2.2Detailed Design Procedure
      3. 8.2.3Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1Layout Guidelines
    2. 10.2Layout Example
  11. 11Device and Documentation Support
    1. 11.1Receiving Notification of Documentation Updates
    2. 11.2Community Resources
    3. 11.3Trademarks
    4. 11.4Electrostatic Discharge Caution
    5. 11.5Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Features

  • 8-Channel Remote Diode Temperature Sensor Accuracy: ±0.75°C (Maximum)
  • Local and Remote Diode Accuracy: ±0.75°C (Maximum)
  • Local Temperature Sensor Accuracy for the DSBGA Package: ±0.35°C (Maximum)
  • Temperature Resolution: 0.0625°C
  • Supply and Logic Voltage Range: 1.7 V to 3.6 V
  • 67-µA Operating Current (1 SPS, All Channels Active)
  • 0.3-µA Shutdown Current
  • Remote Diode: Series Resistance Cancellation,
    η-Factor Correction, Offset Correction, and Diode Fault Detection
  • Register Lock Function Secures Key Registers
  • I2C or SMBus™ Compatible Two-Wire Interface With Pin-Programmable Address
  • 16-Bump DSBGA and 16-Pin VQFN Packages

Applications

  • MCU, GPU, ASIC, FPGA, DSP, and CPU Temperature Monitoring
  • Telecommunication Equipment
  • Servers and Personal Computers
  • Cloud Ethernet Switches
  • Secure Data Centers
  • Highly Integrated Medical Systems
  • Precision Instruments and Test Equipment
  • LED Lighting Thermal Control

Description

The TMP468 device is a multi-zone, high-accuracy, low-power temperature sensor using a two-wire, SMBus or I2C compatible interface. Up to eight remote diode-connected temperature zones can be monitored simultaneously in addition to the local temperature. Aggregating the temperature measurements across a system allows improved performance through tighter guard bands and can reduce board complexity. A typical use case is for monitoring the temperature across different processors, such as MCUs, GPUs, and FPGAs in complex systems such as servers and telecommunications equipment. Advanced features such as series resistance cancellation, programmable non-ideality factor, programmable offset, and programmable temperature limits are included to provide a robust thermal monitoring solution with improved accuracy and noise immunity.

Each of the eight remote channels (and the local channel) can be programmed independently with two thresholds that are triggered when the corresponding temperature is exceeded at the measured location. In addition, there is a programmable hysteresis setting to avoid constant toggling around the threshold.

The TMP468 device provides high accuracy (0.75°C) and high resolution (0.0625°C) measurement capabilities. The device supports low voltage rails (1.7 V to 3.6 V), common two-wire interfaces, and is available in a small, space efficient package (3 mm × 3 mm or 1.6 mm × 1.6 mm) for easy integration into computing systems. The remote junction supports a temperature range from –55°C to +150°C.

Device Information(1)

PART NUMBERPACKAGEBODY SIZE (NOM)
TMP468DSBGA (16)1.60 mm × 1.60 mm
VQFN (16) 3.00 mm × 3.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Typical Application Schematic

TMP468 tmp468_page1_diag_v2.gif
See the Design Requirements section for remote diode recommendations.