Product details

Configuration Audio jack Features Autonomous headset MIC/GND detection (3 or 4 pole), Click/Pop noise reduction, FM Transmission Capability Supply voltage (min) (V) 2.6 Supply voltage (max) (V) 4.7 Supply current (typ) (µA) 6.5 Operating temperature range (°C) -40 to 85 Rating Catalog
Configuration Audio jack Features Autonomous headset MIC/GND detection (3 or 4 pole), Click/Pop noise reduction, FM Transmission Capability Supply voltage (min) (V) 2.6 Supply voltage (max) (V) 4.7 Supply current (typ) (µA) 6.5 Operating temperature range (°C) -40 to 85 Rating Catalog
DSBGA (YFF) 9 1.96000000000000028000000000000001 mm² 1.4000000000000001 x 1.4000000000000001
  • Ground FET Switches (60mΩ typical)
  • Autonomous Detection of Headset Types:
    3-Poles or 4-Poles (with MIC on SLEEVE or RING2)
  • Microphone Line Switches
  • Supports FM Signal Transmission Through the Ground FETs
  • Reduction of Click/Pop Noise
  • VDD Range: 2.6 V – 4.7 V
  • THD (Mic): 0.002% Typical
  • Low Current Consumption: 6.5-µA Typical
  • ±8kV Contract Discharge (IEC 61000-4-2) ESD Performance on SLEEVE and RING2 Pins
  • Ground FET Switches (60mΩ typical)
  • Autonomous Detection of Headset Types:
    3-Poles or 4-Poles (with MIC on SLEEVE or RING2)
  • Microphone Line Switches
  • Supports FM Signal Transmission Through the Ground FETs
  • Reduction of Click/Pop Noise
  • VDD Range: 2.6 V – 4.7 V
  • THD (Mic): 0.002% Typical
  • Low Current Consumption: 6.5-µA Typical
  • ±8kV Contract Discharge (IEC 61000-4-2) ESD Performance on SLEEVE and RING2 Pins

The TS3A226AE is an audio headset switch that detects 3- or 4-pole 3.5mm accessories. For a 4-pole accessory with a microphone, the TS3A226AE also detects the MIC location and routes the microphone and ground signals automatically. The ground signal is routed through a pair of low-impedance ground FETs (60mΩ typical), resulting minimal impact on audio cross-talk performance. The autonomous detection feature allows end users to plug in accessories with different audio pole configurations into the mobile device and have them operate properly with no added software control and complexity. The ground FETs of the device are designed to allow FM signal pass-through, making it possible to use the ground line of the headset as an FM antenna in mobile audio application.

The TS3A226AE is packaged within a 1.2mm × 1.2mm WCSP package, making it suitable for use in mobile application.

The TS3A226AE is an audio headset switch that detects 3- or 4-pole 3.5mm accessories. For a 4-pole accessory with a microphone, the TS3A226AE also detects the MIC location and routes the microphone and ground signals automatically. The ground signal is routed through a pair of low-impedance ground FETs (60mΩ typical), resulting minimal impact on audio cross-talk performance. The autonomous detection feature allows end users to plug in accessories with different audio pole configurations into the mobile device and have them operate properly with no added software control and complexity. The ground FETs of the device are designed to allow FM signal pass-through, making it possible to use the ground line of the headset as an FM antenna in mobile audio application.

The TS3A226AE is packaged within a 1.2mm × 1.2mm WCSP package, making it suitable for use in mobile application.

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Technical documentation

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Type Title Date
* Data sheet AUTONOMOUS AUDIO HEADSET SWITCH, TS3A226AE datasheet (Rev. A) 24 Jul 2013
Technical article USB Type-C™ power: Should your next device have USB Type-C? PDF | HTML 14 Feb 2017
Technical article USB Type-C audio: Do I need to buy a new pair of headphones? PDF | HTML 07 Jul 2016
Application note Support Selfie Sticks Using a TS3A227E Audio Jack Switch 04 Mar 2016
EVM User's guide TS3A226AE EVM Board User’s Guide (Rev. B) 13 Aug 2013
Application note Preventing Excess Power Consumption on Analog Switches 03 Jul 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004

Design & development

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Evaluation board

TS3A226AEEVM — TS3A226AE evaluation module for autonomous audio-headset switch

The TS3A226AEEVM is an evaluation module (EVM) for the Texas Instruments (TI) autonomous audio-headset switch. The EVM provides the basic functionality evaluation for theTS3A226AE device and provides peripheral connector for codec signal connection to MICP, TIP and RING1.

The TS3A226AE is an (...)

User guide: PDF
Not available on TI.com
Simulation model

TS3A226E HSPICE Model

SCDM156.ZIP (476 KB) - HSpice Model
Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Reference designs

TIDA-03030 — USB Type-C™ Power-Path Protection With Audio Accessory Support Reference Design

The TIDA-03030 reference design provides a robust protection solution for the power path in USB Type-C™ applications. The design protects the power path from overvoltage, overcurrent, hot-plug, and reverse-current events by leveraging the TPS25923 (eFuse) and CSD17571Q2 (reverse-blocking (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-00006 — Headset Detection Switch to Detect 3-Pole or 4-Pole 3.5mm Accessories

This reference design is for autonomous audio headset switch applications. Some audio headsets have integrated analog microphones. The GND and MIC connections on the audio jack connector may be swapped depending on the manufacturer. This design has the ability to detect the presence of an analog (...)
Schematic: PDF
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DSBGA (YFF) 9 View options

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