MMC, SD Card, MemoryStick Voltage-Translation With ESD Protection, EMI Filtering, and 2.9 V LDO - TXS0206-29

TXS0206-29 (ACTIVE)

MMC, SD Card, MemoryStick Voltage-Translation With ESD Protection, EMI Filtering, and 2.9 V LDO

Recommended alternative parts

  • TXS0206  -  The device has the SAME FUNCTIONALITY as TXS0206-29 but does not include an integrated 2.9V LDO.
  • TXS0206A  -  This device has the SAME FUNCTIONALITY as TXS0206-29 but does not include an integrated 2.9V LDO.

Features

  • Level Translator
    • VCCA Range of 1.1 V to 3.6 V
    • Fast Propagation Delay (4 ns Max When
      Translating Between 1.8 V and 2.9 V)
  • Low-Dropout (LDO) Regulator
    • 200-mA LDO Regulator With Enable
    • 2.9-V Output Voltage
    • 3.05-V to 5.5-V Input Voltage Range
    • Very Low Dropout: 200 mV at 200 mA
  • ESD Protection Exceeds JESD 22 (A Port)
    • 2000-V Human-Body Model (A114-B)
    • 1000-V Charged-Device Model (C101)
  • ±8-kV Contact Discharge IEC 61000-4-2 ESD (B Port)

All other trademarks are the property of their respective owners.

DESCRIPTION/ORDERING INFORMATION

The TXS0206-29 is a complete solution for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards. It is comprised of a high-speed level translator, a low-dropout (LDO) voltage regulator, IEC level ESD protection, and EMI filtering circuitry.

The voltage-level translator has two supply voltage pins. VCCA can be operated over the full range of 1.1 V to 3.6 V. VCCB is set at 2.9 V and is supplied by an internal LDO. The integrated LDO accepts input voltages from 3.05 V to as high as 5.5 V and outputs 2.9 V, 200 mA to the B-side circuitry and to the external memory card. The TXS0206-29 enables system designers to easily interface low-voltage microprocessors to memory cards operating at 2.9 V.

Memory card standards recommend high-ESD protection for devices that connect directly to the external memory card. To meet this need, the TXS0206-29 incorporates ±8-kV Contact Discharge protection on the card side.

Since memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206-29 an ideal choice for these applications. The TXS0206-29 is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings.

View more

Featured tools and software

Parametrics Compare all products in Application Specific Voltage Translation

 
Operating Temperature Range (C)
Pin/Package
Static Current (mA)
Rating
Special Features
ICCA Static Current (mA)
ICCB Static Current (mA)
TXS0206-29 SN74AVCA406 SN74AVCA406E SN74AVCA406L TXS0206 TXS0206A
-40 to 85     -40 to 85     -40 to 85     -40 to 85     -40 to 85     -40 to 85    
20DSBGA     48BGA MICROSTAR JUNIOR
48TSSOP    
20BGA MICROSTAR JUNIOR
24BGA MICROSTAR JUNIOR    
20BGA MICROSTAR JUNIOR
24BGA MICROSTAR JUNIOR    
20DSBGA     20DSBGA    
0.006     0.02     0.015     0.015     0.011      
Catalog     Catalog     Catalog     Catalog     Catalog     Catalog    
SD/SDIO/MMC Card     SD/SDIO/MMC Card     SD/SDIO/MMC Card     SD/SDIO/MMC Card     SD/SDIO/MMC Card     SD/SDIO/MMC Card    
  0.01     0.01     0.01     0.006     0.007    
  0.01     0.01     0.01     0.005     0.011