Product details

Resolution (Bits) 12 Sample rate (Msps) 21 Gain (min) (dB) 0 Gain (max) (dB) 36 Pd (typ) (mW) 90 Supply voltage (max) (V) 3.3 Operating temperature range (°C) 0 to 70 Output data format CMOS Parallel Rating Catalog
Resolution (Bits) 12 Sample rate (Msps) 21 Gain (min) (dB) 0 Gain (max) (dB) 36 Pd (typ) (mW) 90 Supply voltage (max) (V) 3.3 Operating temperature range (°C) 0 to 70 Output data format CMOS Parallel Rating Catalog
TQFP (PFB) 48 81 mm² 9 x 9
  • 12-Bit, 21-MSPS, Analog-to-Digital Converter
  • Low Power: 70 mW Minimum Power-Down Mode: 4 mW
  • Low Input-Referred Noise: 75-dB SNR Typical at 0-dB Gain
  • Novel Optical-Black (OB) Calibration
  • Low-Aperture Delay
  • Single 3-V Supply Operation
  • DNL: <±0.5 LSB and <±1.5 LSB Typical at 0-dB Gain
  • Programmable-Gain Range: 0 dB to 36 dB, Gain Resolution of 0.05 dB/Step
  • 48-Pin TQFP Package
  • applications
    • Digital Still Camera
    • Digital Video Camera

  • 12-Bit, 21-MSPS, Analog-to-Digital Converter
  • Low Power: 70 mW Minimum Power-Down Mode: 4 mW
  • Low Input-Referred Noise: 75-dB SNR Typical at 0-dB Gain
  • Novel Optical-Black (OB) Calibration
  • Low-Aperture Delay
  • Single 3-V Supply Operation
  • DNL: <±0.5 LSB and <±1.5 LSB Typical at 0-dB Gain
  • Programmable-Gain Range: 0 dB to 36 dB, Gain Resolution of 0.05 dB/Step
  • 48-Pin TQFP Package
  • applications
    • Digital Still Camera
    • Digital Video Camera

The VSP1221 is a highly-integrated mixed-signal IC used for signal conditioning and analog-to-digital conversion at the output of a CCD array. The IC has a correlated double sampler (CDS) and an analog programmable-gain amplifier (PGA) stage followed by an analog-to-digital converter (ADC) and a digital PGA stage. The CDS is used to sample the CCD signal and is followed by the analog PGA stage. The ADC is a 12-bit, 21-MSPS pipelined ADC. The digital PGA provides further amplification.

Additionally, there is an offset calibration loop for optical-black correction. The optical-black reference level is user-programmable. The chip also has two eight-bit digital-to-analog converters (DAC) for external analog settings.

The chip has a serial port for configuring internal control registers.

The VSP1221 is available in a 48-pin TQFP package and operates from a single 3-V power supply.

The VSP1221 is a highly-integrated mixed-signal IC used for signal conditioning and analog-to-digital conversion at the output of a CCD array. The IC has a correlated double sampler (CDS) and an analog programmable-gain amplifier (PGA) stage followed by an analog-to-digital converter (ADC) and a digital PGA stage. The CDS is used to sample the CCD signal and is followed by the analog PGA stage. The ADC is a 12-bit, 21-MSPS pipelined ADC. The digital PGA provides further amplification.

Additionally, there is an offset calibration loop for optical-black correction. The optical-black reference level is user-programmable. The chip also has two eight-bit digital-to-analog converters (DAC) for external analog settings.

The chip has a serial port for configuring internal control registers.

The VSP1221 is available in a 48-pin TQFP package and operates from a single 3-V power supply.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 1
Type Title Date
* Data sheet 12-Bit, 21-MSPS, UltraLow-Power CCD Signal Processor datasheet (Rev. B) 16 Apr 2014

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Package Pins Download
TQFP (PFB) 48 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos