Continued chip scaling to smaller process geometries is imperative for achieving the low power, high performance and higher densities our embedded processing products need to give our customers a competitive advantage.

Joint development model

TI’s internal advanced CMOS development team works side-by-side with foundry partners to ensure that our processes, technology offerings and transistors are tuned to address the varying needs of TI customers. This includes close monitoring of the latest innovations in materials, lithography and other process technology developments to understand the implications, opportunities and challenges for future product roadmaps.

High volume advanced CMOS development model

• Jointly defined TI process
• TI specific models
• Electrical compatibility and design portability

Our foundry and assembly/test partners supplied more than half of TI’s digital CMOS capacity at the peak of the 130-nanometer (nm) and 90-nm nodes, and we expect this percentage to grow even higher at the peak of 65-nm production. TI sampled its first 45-nm products in December of 2007, and we expect production at the foundries later this year. In addition, we have produced our first 32/28-nm test chips, which demonstrated an ultra-small SRAM bit of .12 microns squared that is half the size of our 45-nm cells. Techniques such as full immersion lithography and High K/metal gate technology keep TI and its customers on the leading edge.

Back to Top

Extending innovation

You must have JavaScript and Flash enabled to view this content. VP Tom Thorpe on how TI’s advanced CMOS development and hybrid manufacturing strategy supports TI’s Embedded Processing customers

By leveraging the foundries for both development and manufacturing, TI is able to allocate more resources toward innovation at the design level, and differentiation through increased SoC integration and improved scalability for our embedded processing products. This also includes efforts to continue to reduce power consumption and optimize performance across our products.

An example of this is TI’s SmartReflex^™ technologies a collection of hardware and software techniques to bring improved power efficiency to portable devices. Integrated in over one billion devices shipped to date, the impact of SmartReflex is tremendous. In our OMAP3430, for example, SmartReflex delivers a 66 percent reduction in active power consumption and 3X reduction of standby power, which allows our customers to deliver a better user experience through their products by offering much longer battery life when running advanced features.

Back to Top