Commitment to analog

You must have JavaScript and Flash enabled to view this content. VP Venu Menon on how TI’s Analog’s manufacturing process technologies support TI’s Analog customers today and well into the future

Analog plays a critical role in today’s digital world, translating real-world signals like sight, sound, temperature and pressure into the ones and zeros of digital processing. Without analog technology, access to the digital services that we enjoy today would not exist. And at TI, our commitment to analog runs very deep. As the market leader, TI offers the most comprehensive portfolio of analog products, from amplifiers, data converters, power management and interface chips to highly-integrated, application- specific devices. TI’s tens of thousands of analog products are helping to solve some of today’s biggest challenges in applications, including energy, healthcare, public safety and more.

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In-house development

TI invests significantly in analog technology development and manufacturing. Maintaining these capabilities in-house best serves our customers, as foundries often do not support the volumes or highly specialized processes required.

We continue to differentiate analog products cost effectively with internal process technology development. In 2007, TI increased the size of its analog technology development and modeling teams by 50 percent to strengthen and expand these proprietary processes that serve as the foundation of our analog products. Our broad range of process technologies deliver the faster speeds, higher precision, lower power, smaller sizes and increased functionality that allow TI’s analog engineers to develop chips that help customers to be competitive in the markets they serve.

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Investment in Analog manufacturing

By focusing analog development and manufacturing in-house, TI’s analog process engineers, design teams and manufacturing experts collaborate closely to assure that TI develops the differentiated processes for our products that address our customers’ requirements – and delivers those products on time.

TI is committed to making the necessary capital equipment and capacity investments to continue to strengthen its in-house manufacturing capabilities to deliver the performance, volumes and low costs that our analog customers need throughout product life cycles that can span anywhere from five to 20 years.

Some examples include:

• Expanding wafer capacity
• Building inventory buffers
• Growing assembly and test capabilities where analog wafers are diced, packaged and tested for functionality.

In addition, beginning in October 2009, TI will open the world’s most advanced analog manufacturing facility. Called RFAB, the facility will be the world’s first such site to manufacture 300-millimeter (12-inch) wafers on which thousands of analog chips will be etched. TI plans to ship the first chips from the new factory by the end of 2010.

TI Clark A/T facility

TI is investing significantly in its in-house assembly and test (A/T) capabilities. In 2009, TI began production at our newest A/T facility in the Philippines’ Clark Freeport Zone, bringing added capacity, faster cycle times and efficiencies to TI customers. At 77,000 square meters in size, TI Clark serves as the company’s most sophisticated A/T site. Advancements toward smaller packages and wafer-scale chip packaging will support analog growth from this facility well beyond the next decade.

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