| Date |
Event |
2006
June |
TI disclosed its 45-nm
process technology that leverages a “wet”
lithography process to double the number of chips produced
on each silicon wafer. The process technology takes SoC
processors to new levels, increasing performance by 30
percent and reducing power consumption by 40 percent. |
2006
February |
At ISSCC, researchers from TI, MIT and DARPA presented
an ultra-low power SRAM manufactured on TI’s advanced
65-nm process that features the industry’s lowest
reported voltages. |
2005
December |
TI qualified its 65-nm process and moves to volume manufacturing,
only eight months after first delivering samples. |
2005
September |
TI outlined SmartReflex™ technologies that are
being implemented at 65-nm and beyond, and promise to
solve power consumption challenges for advanced mobile
devices through leakage management. |
2005
March |
TI delivered the industry’s first 65-nm digital
baseband processor for advanced wireless devices. TI is
among the first semiconductor manufacturers to deliver
working 65-nm products. |
2005
March |
Enabled by TI’s 90-nm process technology, the
company’s 1 GHz DSP is recognized by In-Stat as
the “best DSP chip of 2004.” |
2005
February |
As the ISSCC conference, TI outlined a number of techniques
to further SoC integration, reduce power consumption and
increase performance of 90-nm devices. |
2005
February |
TI disclosed that it has shipped over six million 90-nm
devices, and has over 20 products in various stages of
production on the process. |
2005
January |
TI unveiled its cooperation with Nokia to develop future
mobile phones based on the company’s integrated,
single-chip solution. The device that sampled in December
2004 is enabled by TI’s advanced 90-nm process technology.
|
2004
November |
TI entered volume production of its 1 GHz DSPs that
leverage the 90-nm process for increased performance of
innovative applications |
2004
October |
TI set a November groundbreaking for its second 300-mm
manufacturing facility that will be planned for 65-nm
production |
2004
October |
TI qualified 90-nm process technology in its DMOS6
advanced 300-mm fab in Dallas, Texas |
2004
June |
At the prestigious VLSI Symposium, TI presented research
on techniques to potentially reduce power leakage by up
to 1000 X, and improve transistor performance by up to
35 percent for future process generations |
2004
May |
TI extended the IMEC relationship by joining the working
group focused on sub-45-nm research and CMOS scaling challenges |
2004
April |
TI’s 6.25 Gbps serial/deserializer (SerDes) technology
became available in 90-nm process, featuring the industry’s
lowest power and ability to integrate over 200 channels
on-chip |
2004
March |
TI announced its plan to deliver samples of 65-nm-based
product in 1Q05, with anticipated shrinks of 90-nm designs
by half and 40 percent lower power consumption |
2004
January |
TI shipped the industry’s first 1GHz DSPs on 90-nm
process |
2003
December |
TI researchers presented results on Hafnium Silicon
Oxynitride (HfSiON) material and its viability for high-k
and continuing Moore’s Law |
2003
December |
The industry’s first wireless applications processor
on 90-nm process was announced, delivering up to a 40
percent performance improvement with as little as half
the power of other TI applications processors |
2003
October |
TI disclosed techniques to enhance performance of its
90-nm process including strained silicon that result in
a 50 percent improvement in transistor speeds over TI’s
fastest 130-nm transistor |
2003
October |
Sun and TI celebrate their 15-year anniversary and
achievements, including the simultaneous launch of Sun’s
UltraSPARC® IV processor |
2003
June |
TI selected Richardson, Texas as the site of its next
300-mm manufacturing facility and investment of $3 billion
|
2003
January |
TI delivered a fully-functional wireless digital baseband
chip on its 90-nm process, making the company one of the
first to deliver working 90-nm product |
2002
November |
TI unveiled support of embedded FRAM as a future non-volatile
memory option with 64-megabit test chips. First product
expected in early ’05 |
2002
October |
Sun Microsystems recognized TI as a “best in class”
supplier due to process technology and manufacturing accomplishments
for UltraSPARC® microprocessors |
2002
February |
TI was among the first to disclose its advanced 90-nm
CMOS process technology |
|
